公开(公告)号：US20160105961A1

公开(公告)日：2016-04-14

申请号：US14894558

申请日：2014-05-27

Applicant: LINXENS HOLDING

Inventor： Severine DIEU-GOMONT ,  Bertrand HOVEMAN

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/28 ,  H05K1/02

CPC classification number: H01L24/85 ,  G06K19/07769 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/85 ,  H01L2224/85002 ,  H01L2924/00014 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/115 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/095 ,  H05K2201/09509 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.

Abstract translation: 本发明涉及一种用于制造用于芯片卡模块的印刷电路的方法。 该方法包括通过绝缘材料层彼此绝缘的两层导电材料制成，连接孔延伸穿过绝缘材料层并被导电材料层之一阻挡，提供了不含导电材料的区域 在连接孔周围的另一层导电材料中。 本发明还涉及使用该方法制造的芯片卡的印刷电路和包括这种印刷电路的芯片卡模块。

公开(公告)号：US20170270398A1

公开(公告)日：2017-09-21

申请号：US15309904

申请日：2015-05-13

Applicant: Linxens Holding

Inventor： Christophe MATHIEU ,  Bertrand HOVEMAN

IPC: G06K19/077

Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.