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公开(公告)号：US11685306B2
公开(公告)日：2023-06-27
申请号：US17584164
申请日：2022-01-25
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： Wei-Te Cheng , Kai-Chieh Liang , Kuo-Ming Chiu , Fang-Jung Sun , Chun-Chieh Chang , Yi-Fei Lee
IPC: B60Q1/30 , F21S43/14 , B60Q1/26 , F21S43/20 , B60Q1/44 , H01L25/13 , F21V9/30 , H01L33/10 , H01L33/38 , H01L33/56 , H01L33/62 , F21Y115/10
CPC classification number: B60Q1/30 , B60Q1/2607 , B60Q1/44 , F21S43/14 , F21S43/255 , F21V9/30 , H01L25/13 , H01L33/10 , H01L33/382 , H01L33/56 , H01L33/62 , F21Y2115/10
Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.
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公开(公告)号：US11522108B2
公开(公告)日：2022-12-06
申请号：US17671762
申请日：2022-02-15
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Meng-Sung Chou , Kai-Chieh Liang , Jie-Ting Tsai
Abstract: A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.
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公开(公告)号：US20240234649A9
公开(公告)日：2024-07-11
申请号：US18405060
申请日：2024-01-05
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： MIAO-SAN CHIEN , Kai-Chieh Liang , KUO-MING CHIU
CPC classification number: H01L33/52 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/60 , H01L33/62
Abstract: A light emitting device includes a substrate, a wall, at least one light emitting chip, a protection layer, and a reflection layer. The substrate has a mounting surface. The wall is disposed on the mounting surface and has an inner side surface. An accommodation space is defined by the inner side surface and the mounting surface. The light emitting chip has a top light emitting surface and a side light emitting surface, and is disposed in the accommodation space and on the mounting surface. The protection layer is disposed on the top light emitting surface and the side light emitting surface. A gap is formed between the protection layer and the wall. The reflection layer is disposed in the accommodation space and between the inner side surface and the side light emitting surface. The reflection layer is filled in the gap and contacts the mounting surface.
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公开(公告)号：US20200185569A1
公开(公告)日：2020-06-11
申请号：US16681970
申请日：2019-11-13
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Kai-Chieh Liang , Jie-Ting Tsai
Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.
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5.发明授权公开(公告)号：US11916155B2
公开(公告)日：2024-02-27
申请号：US17326356
申请日：2021-05-21
Inventor： Chien-Hsiu Huang , Bo-Jhih Chen , Kuo-Ming Chiu , Meng-Sung Chou , Wei-Te Cheng , Kai-Chieh Liang , Yun-Ta Chen , Yu-Han Wang
IPC: H01L31/0203 , H01L31/02 , H01L31/18
CPC classification number: H01L31/0203 , H01L31/02005 , H01L31/1876
Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.
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Patent Agency Ranking
公开(公告)号：US20230261156A1
公开(公告)日：2023-08-17
申请号：US18108872
申请日：2023-02-13
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： MIAO-SAN CHIEN , Kai-Chieh Liang , Wei-Te Cheng , KUO-MING CHIU
CPC classification number: H01L33/60 , H01L33/486 , H01L33/62
Abstract: A semiconductor assembly includes a substrate, a retaining wall, a light emitting unit, and a reflective layer. The substrate has a mounting surface. The retaining wall is disposed on the mounting surface and has an inner surface. An accommodation space is defined by the inner surface and the mounting surface. The light emitting unit is disposed in the accommodation space and disposed on the mounting surface. The light emitting unit has an upper light emitting surface and a side light emitting surface. The reflective resin layer is disposed in the accommodation space and disposed between the inner surface and the side light emitting surface. The reflective resin layer contains a based resin, a UV absorber, and reflective particles.
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公开(公告)号：US11462524B2
公开(公告)日：2022-10-04
申请号：US16899686
申请日：2020-06-12
Inventor： Jie-Ting Tsai , Kuo-Ming Chiu , Wei-Te Cheng , Kai-Chieh Liang
IPC: H01L25/16 , H01L33/62 , H01L23/485 , H01L25/075 , H01L33/50 , H01L33/58 , F21V31/00 , H01L33/40 , H01L33/56 , H01L33/60
Abstract: A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.
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公开(公告)号：US11264370B2
公开(公告)日：2022-03-01
申请号：US16898576
申请日：2020-06-11
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Kai-Chieh Liang , Jie-Ting Tsai
IPC: H01L25/16 , H01L23/485 , F21V31/00 , H01L25/075 , H01L33/40 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L23/14 , H01L23/498 , H01L33/54
Abstract: A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.
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公开(公告)号：US10916685B2
公开(公告)日：2021-02-09
申请号：US16009005
申请日：2018-06-14
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Meng-Sung Chou , Kai-Chieh Liang
Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.
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公开(公告)号：US12274102B2
公开(公告)日：2025-04-08
申请号：US17141635
申请日：2021-01-05
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Meng-Sung Chou , Kai-Chieh Liang , Jie-Ting Tsai
IPC: H10H20/85 , H10H20/856 , H10H20/857
Abstract: A package structure is provided. The package structure includes a substrate, an electrode layer, a lighting unit, a wall, and a package compound. The substrate and the wall that is disposed on the substrate jointly define an accommodating space. The lighting unit in the accommodating space and is electrically connected to the electrode layer disposed on the substrate. The package compound covers the electrode layer, and the lighting unit. The package compound includes an attaching portion disposed on a top surface of the lighting unit and a surrounding portion that is arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.
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