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公开(公告)号：US11685306B2
公开(公告)日：2023-06-27
申请号：US17584164
申请日：2022-01-25
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： Wei-Te Cheng , Kai-Chieh Liang , Kuo-Ming Chiu , Fang-Jung Sun , Chun-Chieh Chang , Yi-Fei Lee
IPC: B60Q1/30 , F21S43/14 , B60Q1/26 , F21S43/20 , B60Q1/44 , H01L25/13 , F21V9/30 , H01L33/10 , H01L33/38 , H01L33/56 , H01L33/62 , F21Y115/10
CPC classification number: B60Q1/30 , B60Q1/2607 , B60Q1/44 , F21S43/14 , F21S43/255 , F21V9/30 , H01L25/13 , H01L33/10 , H01L33/382 , H01L33/56 , H01L33/62 , F21Y2115/10
Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.
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公开(公告)号：US09985191B2
公开(公告)日：2018-05-29
申请号：US15231214
申请日：2016-08-08
Inventor： Kuo-Ming Chiu , Meng-Sung Chou , Hung-Jui Chen , Han-Hsing Peng
CPC classification number: H01L33/62 , H01L33/486 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/16195 , H01L2924/00014
Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.
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公开(公告)号：US12274102B2
公开(公告)日：2025-04-08
申请号：US17141635
申请日：2021-01-05
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Meng-Sung Chou , Kai-Chieh Liang , Jie-Ting Tsai
IPC: H10H20/85 , H10H20/856 , H10H20/857
Abstract: A package structure is provided. The package structure includes a substrate, an electrode layer, a lighting unit, a wall, and a package compound. The substrate and the wall that is disposed on the substrate jointly define an accommodating space. The lighting unit in the accommodating space and is electrically connected to the electrode layer disposed on the substrate. The package compound covers the electrode layer, and the lighting unit. The package compound includes an attaching portion disposed on a top surface of the lighting unit and a surrounding portion that is arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.
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公开(公告)号：US11522109B2
公开(公告)日：2022-12-06
申请号：US16681970
申请日：2019-11-13
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Kai-Chieh Liang , Jie-Ting Tsai
Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.
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公开(公告)号：US11489079B2
公开(公告)日：2022-11-01
申请号：US17324267
申请日：2021-05-19
Inventor： Wei-Te Cheng , Kai-Chieh Liang , Jie-Ting Tsai , Bo-Jhih Chen , Zi-Jun Lin , Kuo-Ming Chiu
IPC: H01L31/0232 , H01L31/0203 , H01L25/16 , H01L31/108 , H01L31/09
Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.
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Patent Agency Ranking
公开(公告)号：US09853196B2
公开(公告)日：2017-12-26
申请号：US15153317
申请日：2016-05-12
Inventor： Hung-Jui Chen , Kuo-Ming Chiu , Shih-Chiang Yen
IPC: H01L29/20 , H01L33/60 , H01L25/075 , H01L33/58
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/58
Abstract: A light-emitting display device includes a substrate, several light emitting units for emitting light with different wavelengths, and an optical lens. The substrate has at least one receiver for containing these light emitting units. A light guide structure of the light-emitting display device can be the receiver with a specific designed, a frame body with at least one corresponding through hole formed on the corresponding receiver, or at least one optical element formed on the corresponding receiver, so as the light emitted by the light emitting units can be reflected towards the preset optical axis. And the optical lens is formed on the light guide structure as medium for mixing lights of different wavelengths for achieving a uniform lighting effect.
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公开(公告)号：US11522108B2
公开(公告)日：2022-12-06
申请号：US17671762
申请日：2022-02-15
Inventor： Wei-Te Cheng , Kuo-Ming Chiu , Meng-Sung Chou , Kai-Chieh Liang , Jie-Ting Tsai
Abstract: A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.
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公开(公告)号：US10355179B2
公开(公告)日：2019-07-16
申请号：US15679536
申请日：2017-08-17
Inventor： Kuo-Ming Chiu
IPC: H01L33/52
Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.
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公开(公告)号：US09748454B2
公开(公告)日：2017-08-29
申请号：US14954364
申请日：2015-11-30
Inventor： Chen-Hsiu Lin , Kuo-Ming Chiu
CPC classification number: H01L33/60 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
Abstract: An LED package structure includes a chip carrier and an LED chip. The chip carrier includes a ceramic substrate, a circuit layer, a ceramic reflective plate disposed on the ceramic substrate, and a metal slug. The ceramic substrate has a first thru-hole. A main portion of the metal slug is embedded in the first thru-hole, and partially protrudes from the first thru-hole with a height of 10˜30 μm to define as a protrusion block. An extending portion of the metal slug is connected to the outer edge of protrusion block, and the top surfaces of extending portion and protrusion block are coplanar to define a mounting surface. The ceramic reflective plate has a second thru-hole, and the mounting surface is exposed from the ceramic reflective plate via the second thru-hole. The LED chip is fixed on the mounting surface and is electrically connected to the circuit layer.
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公开(公告)号：US09441817B2
公开(公告)日：2016-09-13
申请号：US14474449
申请日：2014-09-02
Inventor： Kuo-Ming Chiu , Meng-Sung Chou , Chen-Hsiu Lin
IPC: F21S4/00 , F21V21/00 , F21V19/00 , F21Y101/02 , F21Y105/00
CPC classification number: F21V19/0055 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10
Abstract: A light-emitting structure comprises a carrier, a light-emitting diode package, and a fixing module. The light-emitting diode package comprises a brittle substrate and a light-emitting unit. The brittle substrate is disposed on the carrier and the light-emitting unit is disposed on the brittle substrate. The fixing module comprises at least two screw units and at least two elastic members which sleeve the screw unit respectively. Each of screw units is screwed onto the carrier and applies a force on the upper surface of the brittle substrate, so as to fasten the brittle substrates to the carrier. Each of elastic members is disposed between the respective screw unit and the carrier, so as to adjust the force from the screw unit.
Abstract translation: 发光结构包括载体，发光二极管封装和定影模块。 发光二极管封装包括脆性衬底和发光单元。 脆性基板设置在载体上，发光单元设置在脆性基板上。 固定模块包括至少两个螺钉单元和至少两个弹性构件，其分别套合螺钉单元。 将每个螺丝单元拧到载体上并在脆性基底的上表面上施加力，以将脆性基底固定到载体上。 每个弹性构件设置在相应的螺钉单元和载体之间，以便调节来自螺钉单元的力。
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