公开(公告)号：US09504165B2

公开(公告)日：2016-11-22

申请号：US14161122

申请日：2014-01-22

Applicant: LUXSHARE-ICT CO., LTD.

Inventor： Devin Wang

IPC: H05K3/18 ,  H05K3/14 ,  B23K26/36 ,  B23K26/40 ,  H05K3/06

CPC classification number: H05K3/188 ,  B23K26/361 ,  B23K26/362 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  H05K3/061 ,  H05K3/143 ,  H05K3/146 ,  H05K2201/09018 ,  Y10T29/49155

Abstract: A method of forming conductive traces on insulated substrate includes the steps of providing an insulated substrate; forming a coating layer on a surface of the insulated substrate, dividing the coating layer into traces-forming zones and non-traces-forming zones through laser engraving, and removing areas of the coating layer that are located in the traces-forming zones through laser-vaporizing to expose corresponding portions of the surface of the insulated substrate; forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the insulated substrate and on the coating layer; and directly stripping off the residual coating layer from the non-traces-forming zones or removing it using an acid, an alkaline or a neutral solution.

Abstract translation: 在绝缘基板上形成导电迹线的方法包括提供绝缘基板的步骤; 在绝缘基板的表面上形成涂层，通过激光雕刻将涂层分成痕迹形成区和非痕迹形成区，通过激光去除位于痕迹形成区中的涂层的区域 - 蒸发以暴露绝缘基板的表面的相应部分; 通过对所述绝缘基板的暴露部分和所述涂层进行金属化处理来形成导电迹线的金属化层; 并直接从非痕量形成区剥离残留的涂层，或者使用酸，碱或中性溶液除去残留的涂层。