公开(公告)号：US09366390B2

公开(公告)日：2016-06-14

申请号：US14288396

申请日：2014-05-28

Applicant: Lextar Electronics Corporation

Inventor： Jia-Jhang Kuo ,  Su-Hon Lin ,  Yun-Yi Tien

IPC: F21K99/00 ,  H01L33/60 ,  F21Y101/02 ,  F21V3/00 ,  H01L25/075 ,  H05K1/02

CPC classification number: F21K9/135 ,  F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode (LED) device includes a transparent substrate, a first reflection layer, a LED chip, a positive electrode, a negative electrode and a wavelength-converting layer. The LED chip is disposed on a surface of the transparent substrate, and the first reflection layer is disposed between the LED chip and the transparent substrate. The positive electrode and the negative electrode are disposed on an end portion of the transparent substrate and are electrically connected with the LED chip. The wavelength-converting layer covers the first reflection layer and the LED chip.

Abstract translation: 发光二极管（LED）装置包括透明基板，第一反射层，LED芯片，正极，负极和波长转换层。 LED芯片设置在透明基板的表面上，第一反射层设置在LED芯片和透明基板之间。 正极和负极设置在透明基板的端部上并与LED芯片电连接。 波长转换层覆盖第一反射层和LED芯片。

公开(公告)号：USD730848S1

公开(公告)日：2015-06-02

申请号：US29496032

申请日：2014-07-08

Applicant: LEXTAR ELECTRONICS CORPORATION

Designer： Su-Hon Lin

公开(公告)号：US09166125B2

公开(公告)日：2015-10-20

申请号：US14326905

申请日：2014-07-09

Applicant: Lextar Electronics Corporation

Inventor： Su-Hon Lin

IPC: H01L33/00 ,  H01L25/00 ,  H01L33/50 ,  H01L33/60 ,  H01L25/075

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2224/48137

Abstract: A comprehensive light-emitting diode device including a translucent substrate, a light-emitting diode chip, a reflective layer, a first wavelength conversion layer, and a second wavelength conversion layer. The translucent substrate includes a first surface and a second surface opposite to the first surface. The light-emitting diode chip is disposed on the first surface. The reflective layer is disposed on the first surface. The light-emitting diode chip is surrounded by the reflective layer. The first wavelength conversion layer is disposed on the first surface. The light-emitting diode chip and the reflective layer are covered by the first wavelength conversion layer.

Abstract translation: 一种包括半透明基板，发光二极管芯片，反射层，第一波长转换层和第二波长转换层的综合发光二极管装置。 半透明基板包括与第一表面相对的第一表面和第二表面。 发光二极管芯片设置在第一表面上。 反射层设置在第一表面上。 发光二极管芯片被反射层包围。 第一波长转换层设置在第一表面上。 发光二极管芯片和反射层被第一波长转换层覆盖。

公开(公告)号：US20150255689A1

公开(公告)日：2015-09-10

申请号：US14326905

申请日：2014-07-09

Applicant: Lextar Electronics Corporation

Inventor： Su-Hon Lin

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2224/48137

Abstract: A comprehensive light-emitting diode device including a translucent substrate, a light-emitting diode chip, a reflective layer, a first wavelength conversion layer, and a second wavelength conversion layer. The translucent substrate includes a first surface and a second surface opposite to the first surface. The light-emitting diode chip is disposed on the first surface. The reflective layer is disposed on the first surface. The light-emitting diode chip is surrounded by the reflective layer. The first wavelength conversion layer is disposed on the first surface. The light-emitting diode chip and the reflective layer are covered by the first wavelength conversion layer.

Abstract translation: 一种包括半透明基板，发光二极管芯片，反射层，第一波长转换层和第二波长转换层的综合发光二极管装置。 半透明基板包括与第一表面相对的第一表面和第二表面。 发光二极管芯片设置在第一表面上。 反射层设置在第一表面上。 发光二极管芯片被反射层包围。 第一波长转换层设置在第一表面上。 发光二极管芯片和反射层被第一波长转换层覆盖。

公开(公告)号：US09203000B2

公开(公告)日：2015-12-01

申请号：US14207394

申请日：2014-03-12

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Su-Hon Lin

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/48 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package.

Abstract translation: 公开了一种发光器件封装。 发光器件封装包括金属衬底。 绝缘层在金属基板上，其中绝缘层具有至少一个露出金属基板的开口。 至少一个发光器件设置在绝缘层的至少一个开口中。 绝缘层的至少一个开口的侧壁被光学隔离物覆盖。 本公开还提供了一种制造发光器件封装的方法。

公开(公告)号：US20140103378A1

公开(公告)日：2014-04-17

申请号：US13952709

申请日：2013-07-29

Applicant: Lextar Electronics Corporation

Inventor： Su-Hon Lin

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A light-emitting diode structure is provided. The light-emitting diode structure comprises a substrate, a light-emitting diode device, a ring-shaped dam and an optical lens. The substrate has an upper surface. The light-emitting diode device is disposed on the upper surface of the substrate for emitting a first light having a first wavelength. The ring-shaped dam is disposed on the upper surface of the substrate, and surrounds the light-emitting diode device. The optical lens is disposed on the substrate, and encapsulates the ring-shaped dam and the light-emitting diode device. The optical lens and the ring-shaped dam and the light-emitting diode device form a cavity.

Abstract translation: 提供了一种发光二极管结构。 发光二极管结构包括基板，发光二极管装置，环形坝和光学透镜。 基板具有上表面。 发光二极管装置设置在用于发射具有第一波长的第一光的基板的上表面上。 环形坝设置在基板的上表面上并且围绕发光二极管装置。 光学透镜设置在基板上，并且封装环形坝和发光二极管装置。 光学透镜和环形坝和发光二极管装置形成空腔。