公开(公告)号：US20210272891A1

公开(公告)日：2021-09-02

申请号：US17303030

申请日：2021-05-18

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Jorge E. Carbo ,  Trevor Spiegel Antonio Rivera ,  Charles Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20200381349A1

公开(公告)日：2020-12-03

申请号：US16885854

申请日：2020-05-28

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Jorge E. Carbo ,  Trevor Spiegel Antonio Rivera ,  Charles Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20200066628A1

公开(公告)日：2020-02-27

申请号：US16548379

申请日：2019-08-22

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Trevor Spiegel Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Godshalk ,  Charles Kinzel

IPC: H01L23/498 ,  H01L23/31

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.