公开(公告)号：US12205878B2

公开(公告)日：2025-01-21

申请号：US18316586

申请日：2023-05-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/52

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11688677B2

公开(公告)日：2023-06-27

申请号：US17303030

申请日：2021-05-18

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L21/485 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20210272891A1

公开(公告)日：2021-09-02

申请号：US17303030

申请日：2021-05-18

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Jorge E. Carbo ,  Trevor Spiegel Antonio Rivera ,  Charles Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20240047334A1

公开(公告)日：2024-02-08

申请号：US18316586

申请日：2023-05-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/485 ,  H01L21/4857 ,  H01L23/3157

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11882653B2

公开(公告)日：2024-01-23

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/036 ,  H05K1/181 ,  H05K3/303 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11682615B2

公开(公告)日：2023-06-20

申请号：US16885854

申请日：2020-05-28

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L21/485 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20220377885A1

公开(公告)日：2022-11-24

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20200381349A1

公开(公告)日：2020-12-03

申请号：US16885854

申请日：2020-05-28

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Jorge E. Carbo ,  Trevor Spiegel Antonio Rivera ,  Charles Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.