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公开(公告)号：US20240431077A1
公开(公告)日：2024-12-26
申请号：US18823089
申请日：2024-09-03
Applicant: Liquid Wire Inc.
IPC: H05K7/20
Abstract: A thermal interface applique and system includes a containment structure and conductive gel. The containment structure has an adhesive property and a first thermal coefficient. The conductive gel is configured to thermally couple a heat source to a heatsink. The adhesive property of the containment structure is configured to adhere at least one of the heat source and the heatsink to the containment structure
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