公开(公告)号：US20190215955A1

公开(公告)日：2019-07-11

申请号：US16351250

申请日：2019-03-12

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Stephen GONYA ,  Kenn TWIGG ,  Jim PATTERSON

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/46

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.

公开(公告)号：US20160155711A1

公开(公告)日：2016-06-02

申请号：US15014160

申请日：2016-02-03

Applicant: Lockheed Martin Corporation

Inventor： Stephen GONYA ,  Jesse IANNON

IPC: H01L23/00 ,  H01L23/552

CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

公开(公告)号：US20170084356A1

公开(公告)日：2017-03-23

申请号：US15367642

申请日：2016-12-02

Applicant: Lockheed Martin Corporation

Inventor： Stephen GONYA ,  Jesse IANNON

IPC: G21F3/00 ,  H05K1/02

CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

公开(公告)号：US20180192513A1

公开(公告)日：2018-07-05

申请号：US15876552

申请日：2018-01-22

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Stephen GONYA ,  Kenn TWIGG ,  Jim PATTERSON

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2203/0315

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.