公开(公告)号：US20030222335A1

公开(公告)日：2003-12-04

申请号：US10448921

申请日：2003-05-29

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa ,  Tsunenori Yoshida ,  Yoshihisa Yamashita ,  Hiroyuki Ishitomi

IPC: H01L023/02

CPC classification number: H01G2/065 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.

Abstract translation: 本发明的电路部件封装包括：安装构件，包括基板和设置在基板上的布线图案;电路部件，包括部件主体和设置在部件主体的端部的外部电极，电路部件布置在 安装构件和将外部电极与布线图案电连接的导电材料。 在电路部件中，部件主体的形状使得设置有外部电极的部件主体的第一部分比部件主体的第二部分薄，第二部分是外部电极不在其上的部分 并且进一步地，外部电极相对于包含组件主体的预定表面的参考平面布置在组件主体位于其一侧的区域中。 电路部件设置在安装部件上，使得部件主体与安装部件接触。 当电路部件安装在安装部件上时，部件主体的预定表面是组件主体的与安装部件相对的表面。

公开(公告)号：US20040191491A1

公开(公告)日：2004-09-30

申请号：US10804612

申请日：2004-03-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yasuhiro Sugaya ,  Hiroyuki Ishitomi ,  Seiichi Nakatani

IPC: B32B015/08 ,  B32B009/04

CPC classification number: H05K3/382 ,  H05K3/06 ,  H05K3/20 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/1461 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2843 ,  Y10T428/31681

Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60null C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 nullm or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.

Abstract translation: 本发明的转印片包括玻璃化转变温度不低于60℃的树脂膜，形成在树脂膜上的硅树脂层和形成在硅树脂层上的金属布线图案。 金属布线图案具有形成粗糙面的露出面，粗糙面的平均表面粗糙度（Rz）为2μm以上，而与硅树脂接触的布线图案的面 树脂层的表面粗糙度（Rz）低于露出面。 因此，本发明提供一种转印片材，其具有能够在低温下进行转印，改善的尺寸稳定性和通孔连接可靠性的转印性能。 本发明还提供一种使用转印片的布线板及其制造方法。