公开(公告)号：US20230014046A1

公开(公告)日：2023-01-19

申请号：US17848417

申请日：2022-06-24

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Sheng-Mou Lin

IPC: H01L23/552

Abstract: According to an embodiment of the invention, a semiconductor device comprises a substrate, a semiconductor die and a first shielding structure. The semiconductor die is disposed on the substrate and comprises an electronic device. The first shielding structure is formed outside of the semiconductor die and disposed under the electronic device.

公开(公告)号：US20240038690A1

公开(公告)日：2024-02-01

申请号：US18211551

申请日：2023-06-19

Applicant: MEDIATEK INC.

Inventor： Po-Jui Li ,  Ruey-Bo Sun ,  Yen-Ju Lu ,  Chun-Yuan Yeh ,  Sheng-Mou Lin

IPC: H01L23/64 ,  H01L23/522

CPC classification number: H01L23/645 ,  H01L23/5227 ,  H01L23/5221 ,  H01L28/10

Abstract: A semiconductor device includes an electronic device, a guard trace and a first trace. The guard trace is connecting to a ground layer through a first ground via. The first trace is disposed adjacent to the electronic device and the guard trace and includes a first segment. A phase or a direction of a first current signal conducted on the first trace is changed in the first segment. The electronic device and the first trace are disposed at different sides of the guard trace and the first ground via is beside the first segment.

公开(公告)号：US20220254868A1

公开(公告)日：2022-08-11

申请号：US17544883

申请日：2021-12-07

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun

IPC: H01L49/02 ,  H01F27/28 ,  H01F27/29 ,  H01F27/40

Abstract: A semiconductor device includes a substrate; a first terminal and a second terminal; and a conductor arranged on the substrate between the first terminal and the second terminal to constitute an inductor shaped for forming a first loop and a second loop. A first crossing of the conductor with itself is present between the first loop and the second loop. The first loop and the second loop define a first enclosed area and a second enclosed area, respectively. The first enclosed area is smaller than the second enclosed area.

公开(公告)号：US12191342B2

公开(公告)日：2025-01-07

申请号：US17544883

申请日：2021-12-07

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/40 ,  H01G4/40 ,  H01L49/02

Abstract: A semiconductor device includes a substrate; a first terminal and a second terminal; and a conductor arranged on the substrate between the first terminal and the second terminal to constitute an inductor shaped for forming a first loop and a second loop. A first crossing of the conductor with itself is present between the first loop and the second loop. The first loop and the second loop define a first enclosed area and a second enclosed area, respectively. The first enclosed area is smaller than the second enclosed area.

公开(公告)号：US10068857B2

公开(公告)日：2018-09-04

申请号：US15794128

申请日：2017-10-26

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Sheng-Mou Lin ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/495 ,  H01L49/02 ,  H01L23/522

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.

公开(公告)号：US20240038443A1

公开(公告)日：2024-02-01

申请号：US18218003

申请日：2023-07-03

Applicant: MEDIATEK INC.

Inventor： Hsin-Yu Hung ,  Ruey-Bo Sun ,  Sheng-Mou Lin

IPC: H01F27/34 ,  H01F27/29 ,  H01F27/28

CPC classification number: H01F27/34 ,  H01F27/29 ,  H01F27/2804

Abstract: A semiconductor device includes a substrate; a first terminal and a second terminal; and a conductor arranged on the substrate between the first terminal and the second terminal to constitute an inductor shaped for forming a first loop and a second loop arranged side-by-side along a first direction. A crossing of the conductor with itself is present between the first loop and the second loop. The first loop and the second loop define a first enclosed area and a second enclosed area, respectively. At least one ground bar traverses either the first loop or the second loop.

公开(公告)号：US20180350751A1

公开(公告)日：2018-12-06

申请号：US15973541

申请日：2018-05-08

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/373 ,  H01L23/06 ,  H01L23/64 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/552 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K7/20454 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/1056

Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

公开(公告)号：US20180122747A1

公开(公告)日：2018-05-03

申请号：US15794128

申请日：2017-10-26

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Sheng-Mou Lin ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/522 ,  H01L49/02 ,  H01L23/495

CPC classification number: H01L23/552 ,  H01L23/4951 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L25/16 ,  H01L28/10 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.