公开(公告)号：US20250145844A1

公开(公告)日：2025-05-08

申请号：US18934489

申请日：2024-11-01

Applicant: Meta Platforms Technologies, LLC

Inventor： Wenyang Pan ,  Kristopher Erickson ,  Zixuan Deng ,  Zhenzhen Shen ,  Cameron Glasscock

IPC: C09D11/102 ,  C08K3/105 ,  C09D11/033

Abstract: Described herein are compositions and methods for wetting and adhering noble metal inks to silicone substrates. The metal ink-silicone interface is modified by functionalizing the surface of noble metal nanoparticles (NPs) or nanowires (NWs), and/or the surface of silicone substrates, with a small molecule binder for thiol-noble metal bonding.

公开(公告)号：US20240092987A1

公开(公告)日：2024-03-21

申请号：US18467201

申请日：2023-09-14

Applicant: Meta Platforms Technologies, LLC

Inventor： Li Yao ,  Wenyang Pan ,  Ziyan Liu ,  Shawn Reese ,  Thomas John Farrell Wallin ,  Zhenzhen Shen ,  Fang He ,  Robert Cole Bolger-Cruz ,  Sudhanshu Rathod ,  Kristopher Erickson

IPC: C08J9/00 ,  A61B5/268

CPC classification number: C08J9/0076 ,  A61B5/268 ,  C08K3/046 ,  C08K2201/001 ,  C08K2201/011

Abstract: Described herein are conductive elastomeric foam materials and methods of making and using the same. The conductive elastomeric foam materials include a polymeric matrix, one or more conductive fillers, and one or more foaming agents. The polymeric matrix can include a thermoset polymer or a thermoplastic polymer. Also described herein are methods of making conductive elastomeric foam materials. Further described herein are molded products including the conductive elastomeric foam materials as described herein and wearable devices including the molded products.

公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

公开(公告)号：US11726566B1

公开(公告)日：2023-08-15

申请号：US17725521

申请日：2022-04-20

Applicant: META PLATFORMS TECHNOLOGIES, LLC

Inventor： Li Yao ,  Tianshu Liu ,  Harsha Prahlad ,  Priyanshu Agarwal ,  Daniele Piazza ,  Dongsuk Shin ,  Zhenzhen Shen ,  Wenyang Pan ,  Felippe Jose Pavinatto

IPC: G06F3/01 ,  C08F214/22 ,  C08F214/24 ,  C08L27/16

CPC classification number: G06F3/014 ,  C08F214/22 ,  C08F214/242 ,  C08L27/16 ,  G06F3/016

Abstract: Disclosed apparatus may include a membrane, a first electrode supported by the membrane, a second electrode, and optionally a controller configured to control an electrical potential applied between the first electrode and the second electrode. Example apparatus may include one or more flexible membranes that may, at least in part, define an enclosure that is at least partially filled with a dielectric fluid. A flexible membrane may include a functionalized polymer or inorganic dielectric material, such as a fluoropolymer composite including at least one electrically conductive additive and/or at least one toughener. Examples also include associated materials (e.g., polymers), methods of fabrication, methods of apparatus operation, and systems.