公开(公告)号：US20240258172A1

公开(公告)日：2024-08-01

申请号：US18564366

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/78 ,  C09J5/00 ,  C09J7/38 ,  H01L21/683

CPC classification number: H01L21/78 ,  C09J5/00 ,  C09J7/385 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2301/502 ,  C09J2433/00

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan δ at −5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.

公开(公告)号：US20240258151A1

公开(公告)日：2024-08-01

申请号：US18564379

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J133/10 ,  H01L21/3043 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E′ (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E′ (100° C.) of 1.0×106 to 3.0×107 Pa.

公开(公告)号：US20240258150A1

公开(公告)日：2024-08-01

申请号：US18564353

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  H01L21/3043 ,  C09J2203/326 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/502 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20240290648A1

公开(公告)日：2024-08-29

申请号：US18564659

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/30 ,  C09J133/00 ,  H01L21/268 ,  H01L21/304 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/30 ,  C09J133/00 ,  H01L21/268 ,  H01L21/304 ,  H01L21/78 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00

Abstract: A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan δ at −5° C. of 0.25 to 0.85.

公开(公告)号：US20190267273A1

公开(公告)日：2019-08-29

申请号：US16319874

申请日：2017-07-20

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroyoshi KURIHARA

IPC: H01L21/683 ,  C09J9/02 ,  C09J133/08 ,  H01L21/306 ,  H01L23/00

Abstract: A method for manufacturing a semiconductor device includes at least the following three steps. A step (A) of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer. A step (B) of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer. A step (C) of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. In addition, as the adhesive film, an adhesive film having a base material layer, an antistatic layer, and an adhesive resin layer including a conductive additive in this order is used, and the adhesive film is used so that the adhesive resin layer faces the circuit-formed surface side of the semiconductor wafer.

公开(公告)号：US20180244811A1

公开(公告)日：2018-08-30

申请号：US15758013

申请日：2016-07-15

Applicant: Mitsui Chemicals Tohcello, Inc.

Inventor： Hiroyoshi KURIHARA ,  Manami SAITO

IPC: C08F8/30

CPC classification number: C08F8/30 ,  C08F220/18 ,  C08F299/00 ,  C08F2800/20 ,  C08F2810/30 ,  C08G18/227 ,  C08G18/6229 ,  C08G18/8116 ,  C08G2170/40 ,  C08G2190/00 ,  C08J3/24 ,  C08J2333/14 ,  C08J2375/16 ,  C09D175/16 ,  C09J133/066 ,  C09J175/16 ,  C08F2220/1825 ,  C08F220/14 ,  C08F220/20

Abstract: The present invention is a method for producing a polyfunctional polymer that contains a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain, and is characterised by including a reaction process in which a polymer (P) containing a structural unit (a) having a hydroxy group in a side chain and a monomer (M) having an isocyanate group and a polymerizable unsaturated bond are reacted in the presence of a bismuth carboxylate.

公开(公告)号：US20240274460A1

公开(公告)日：2024-08-15

申请号：US18564794

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/50 ,  H01L21/304 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×106 to 3.5×107 Pa, and E′) (100° C./E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20240258152A1

公开(公告)日：2024-08-01

申请号：US18564419

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/30 ,  C09J133/00 ,  H01L21/304 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/30 ,  C09J133/00 ,  H01L21/304 ,  H01L21/78 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20220319918A1

公开(公告)日：2022-10-06

申请号：US17596021

申请日：2020-05-13

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Toru MIURA ,  Hiroyoshi KURIHARA

IPC: H01L21/768 ,  H01L21/263 ,  H01L21/02

Abstract: A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

公开(公告)号：US20210122946A1

公开(公告)日：2021-04-29

申请号：US17041470

申请日：2019-03-19

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji IGARASHI ,  Jin KINOSHITA ,  Hiroyoshi KURIHARA ,  Toru MIURA

IPC: C09J7/38 ,  H01L21/683 ,  H01L21/56

Abstract: An adhesive film includes a base material layer; an adhesive resin layer (A) provided on a first surface side of the base material layer; and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F2.5) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130° C., and an integrated tacking force value (F30) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130° C.