公开(公告)号：US20240290648A1

公开(公告)日：2024-08-29

申请号：US18564659

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/30 ,  C09J133/00 ,  H01L21/268 ,  H01L21/304 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/30 ,  C09J133/00 ,  H01L21/268 ,  H01L21/304 ,  H01L21/78 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00

Abstract: A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan δ at −5° C. of 0.25 to 0.85.

公开(公告)号：US20240258172A1

公开(公告)日：2024-08-01

申请号：US18564366

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/78 ,  C09J5/00 ,  C09J7/38 ,  H01L21/683

CPC classification number: H01L21/78 ,  C09J5/00 ,  C09J7/385 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2301/502 ,  C09J2433/00

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan δ at −5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.

公开(公告)号：US20240258151A1

公开(公告)日：2024-08-01

申请号：US18564379

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J133/10 ,  H01L21/3043 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E′ (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E′ (100° C.) of 1.0×106 to 3.0×107 Pa.

公开(公告)号：US20240258150A1

公开(公告)日：2024-08-01

申请号：US18564353

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  H01L21/3043 ,  C09J2203/326 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/502 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20200219734A1

公开(公告)日：2020-07-09

申请号：US16631344

申请日：2018-07-09

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Takashi UNEZAKI ,  Jun KAMADA ,  Akimitsu MORIMOTO ,  Jin KINOSHITA

IPC: H01L21/56 ,  H01L21/304 ,  H01L21/78 ,  H01L21/683

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.

公开(公告)号：US20240379403A1

公开(公告)日：2024-11-14

申请号：US18564680

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  B32B7/12 ,  B32B27/06 ,  C09J5/00 ,  C09J7/38 ,  H01L21/304 ,  H01L21/78

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteristic is measured after curing the ultraviolet curable adhesive resin material by irradiating with an ultraviolet ray, a storage elastic modulus at 5° C. E′ (5° C.) is 2.0×106 to 2.0×109 Pa, and a storage elastic modulus 100° C. E′ (100° C.) is 1.0×106 to 3.0×107 Pa.

公开(公告)号：US20240266203A1

公开(公告)日：2024-08-08

申请号：US18564649

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/50 ,  C09J2433/00 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray has a storage elastic modulus at 5° C. of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. of 1.0×106 to 3.0×107 Pa.

公开(公告)号：US20240249967A1

公开(公告)日：2024-07-25

申请号：US18564371

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tan δ at −5° C. of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, is 0.25 to 0.85.

公开(公告)号：US20240274460A1

公开(公告)日：2024-08-15

申请号：US18564794

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/50 ,  H01L21/304 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×106 to 3.5×107 Pa, and E′) (100° C./E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20240258152A1

公开(公告)日：2024-08-01

申请号：US18564419

申请日：2022-05-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC: H01L21/683 ,  C09J7/30 ,  C09J133/00 ,  H01L21/304 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/30 ,  C09J133/00 ,  H01L21/304 ,  H01L21/78 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68386

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10−3 to 1.5×10−2.