公开(公告)号：US20170365556A1

公开(公告)日：2017-12-21

申请号：US15486403

申请日：2017-04-13

Applicant: MIYOSHI ELECTRONICS CORPORATION

Inventor： Kazuhito MORI

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367

CPC classification number: H01L23/5386 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/32 ,  H01L25/072 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/181 ,  H05K3/4053 ,  H05K2201/09554 ,  H05K2203/049

Abstract: There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus includes a dielectric substrate, an electronic component, a heat spreader, and a conductive via. The conductive via electrically and thermally connects the electronic component and the heat spreader. The conductive via extends from the first surface to at least an interior of the heat spreader and is in surface-contact with the heat spreader.