公开(公告)号：US11735232B2

公开(公告)日：2023-08-22

申请号：US17202326

申请日：2021-03-15

Applicant: MONTAGE TECHNOLOGY CO., LTD.

Inventor： Christopher Cox

IPC: G11C5/04 ,  G11C5/14 ,  H05K1/18

CPC classification number: G11C5/147 ,  G11C5/04 ,  H05K1/181 ,  H05K2201/10159

Abstract: A memory device includes a printed circuit board having a plurality of conductive layers; memory chips mounted over the printed circuit board, wherein the memory chips comprise at least a first number of memory chips and a second number of memory chips; a first power module mounted over the printed circuit board and for providing a first set of power supplies to the first number of memory chips through the plurality of conductive layers; and a second power module mounted over the printed circuit board and for providing a second set of power supplies to the second number of memory chips through the plurality of conductive layers.

公开(公告)号：US20220293139A1

公开(公告)日：2022-09-15

申请号：US17202326

申请日：2021-03-15

Applicant: MONTAGE TECHNOLOGY CO., LTD

Inventor： Christopher Cox

IPC: G11C5/14 ,  H05K1/18 ,  G11C5/04

Abstract: A memory device includes a printed circuit board having a plurality of conductive layers; memory chips mounted over the printed circuit board, wherein the memory chips comprise at least a first number of memory chips and a second number of memory chips; a first power module mounted over the printed circuit board and for providing a first set of power supplies to the first number of memory chips through the plurality of conductive layers; and a second power module mounted over the printed circuit board and for providing a second set of power supplies to the second number of memory chips through the plurality of conductive layers.