公开(公告)号：US11781904B2

公开(公告)日：2023-10-10

申请号：US17530090

申请日：2021-11-18

Applicant: MPI CORPORATION

Inventor： Hung-I Lin ,  Bo-Sian Lee ,  Yi-Hung Chen

IPC: G01R31/26 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0223 ,  G01R31/2635 ,  G01J2001/4252

Abstract: A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.