公开(公告)号：US20250147067A1

公开(公告)日：2025-05-08

申请号：US18938623

申请日：2024-11-06

Applicant: MPI CORPORATION

Inventor： PO-YI TING ,  YU-HSUN HSU ,  TING-AN YEN ,  SEBASTIAN GIESSMANN

IPC: G01R1/04 ,  G01R31/28 ,  G01R31/308

Abstract: A probe system for double side probing includes a chuck having a through hole for a substrate including a DUT to be disposed on the chuck and defined with an edge part supported by the chuck and a central part located correspondingly to the through hole, upper and lower probe devices, including electrical and optical probe devices, disposed above and below the through hole respectively for testing the DUT on top and bottom sides of the substrate, and a support device disposed on the side of the chuck opposite to the electrical probe device. When an electrical probe of the electrical probe device contacts the top or bottom side of the substrate, a supporter of the support device contacts the other side and is located adjacent to the electrical probe with the substrate located therebetween to resist the force from the electrical probe to avoid substrate deformation.

公开(公告)号：US20250102539A1

公开(公告)日：2025-03-27

申请号：US18973444

申请日：2024-12-09

Applicant: MPI CORPORATION

Inventor： STOJAN KANEV ,  MEI-TING LU ,  SEBASTIAN GIESSMANN

IPC: G01R1/067 ,  G01B11/26 ,  G01R1/18 ,  G01R31/28 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

公开(公告)号：US20250044346A1

公开(公告)日：2025-02-06

申请号：US18762988

申请日：2024-07-03

Applicant: MPI CORPORATION

Inventor： ANDREJ RUMIANTSEV ,  Ching-Ling PAI ,  LIN-LIN CHIH

IPC: G01R31/28 ,  G01R35/00

Abstract: To determine whether the current temperature of a probe assembly is stable for the calibration at the auxiliary site, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether adjusting the current temperature of a probe assembly at the wafer site is necessary, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether the current temperature of a probe assembly is ready for testing a semiconductor device, a wafer probe station verifies a measured air standard dataset with a predetermined signal range.

公开(公告)号：US20240393386A1

公开(公告)日：2024-11-28

申请号：US18672151

申请日：2024-05-23

Applicant: MPI Corporation

Inventor： YA-HUNG LO ,  CHIEN-HSUN CHEN ,  SHOU-JEN TSAI ,  FUH-CHYUN TANG

IPC: G01R31/28

Abstract: A method for adjusting position of probing base comprises steps of providing a probing machine comprising a probing holder, a first probing base having a first probing needle comprising a plurality of first probing bodies wherein two adjacent tips of the first probing bodies h a first pitch, and a second probing base having a second probe comprising a plurality of second probing bodies in which two adjacent tips of the second probing bodies has a second pitch, thereafter, grabbing the first probing base and connecting the first probing base to the probing holder, acquiring first image with respect to the plurality of first probing bodies through visual identification module, and finally, adjusting roll angle of probing tips of the plurality of first needle bodies according to the first image. Alternatively, the present invention further provides a probing machine using the method for testing DUTs having different pitches.

公开(公告)号：US11906571B2

公开(公告)日：2024-02-20

申请号：US17700441

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： Chien-Yu Chen ,  Po-Han Peng

IPC: G01R31/26 ,  G02B5/00 ,  H01S5/02212 ,  H01S5/00

CPC classification number: G01R31/2635 ,  G02B5/005 ,  H01S5/0085 ,  H01S5/02212

Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

公开(公告)号：US11536765B2

公开(公告)日：2022-12-27

申请号：US16892076

申请日：2020-06-03

Applicant: MPI Corporation

Inventor： Kang-Yen Fu ,  Ya-Hung Lo ,  Shou-Jen Tsai ,  Wei-Cheng Ku

IPC: G01R31/28 ,  H01L21/67 ,  G01R1/073

Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

公开(公告)号：US11460498B2

公开(公告)日：2022-10-04

申请号：US17034741

申请日：2020-09-28

Applicant: MPI CORPORATION

Inventor： Yang-Hung Cheng ,  Ya-Hung Lo ,  Chien-Hsun Chen ,  Chia-Nan Chou ,  Chung-Yen Huang ,  Shou-Jen Tsai ,  Fuh-Chyun Tang

IPC: G01R31/28 ,  G01R1/073

Abstract: An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

公开(公告)号：US20220299564A1

公开(公告)日：2022-09-22

申请号：US17699610

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： YI-HSUAN CHENG ,  HUNG-I LIN ,  PO-HAN PENG

IPC: G01R31/28 ,  G01R1/067 ,  G01R1/073

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

公开(公告)号：US11348221B2

公开(公告)日：2022-05-31

申请号：US17079030

申请日：2020-10-23

Applicant: MPI Corporation

Inventor： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC: G01N21/95 ,  G06T7/00

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

公开(公告)号：US11346789B2

公开(公告)日：2022-05-31

申请号：US17117477

申请日：2020-12-10

Applicant: MPI CORPORATION

Inventor： Ping-Ying Wu ,  Chiu-Wang Chen ,  Yung-Chin Liu

IPC: G01N21/88

Abstract: An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.