公开(公告)号：US20140163198A1

公开(公告)日：2014-06-12

申请号：US14181866

申请日：2014-02-17

Applicant: MacDermid Acumen, Inc.

Inventor： Andrew M. Krol ,  Ernest Long ,  Lev Taytsas

IPC: C08G73/06 ,  C07D241/46

CPC classification number: C08G73/0633 ,  C07D241/46 ,  C08G73/0694 ,  C25D3/38

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a substituted amine, RX and RY represent any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

Abstract translation: 制备具有以下通式的聚合物苯扎嗪化合物的方法：其中R 1，R 2，R 4，R 5，R 6，R 8和R 9相同或不同，并且表示氢，低级烷基或取代的芳基，R 3从NH 2开始， 重氮化后进行聚合，R 5和R 8可以可选地代表单体或聚合苯扎嗪基团，R7是取代的胺，RX和RY代表CH 3，C 2 H 5和氢的任何组合，只是RX和RY不能都是氢，A是 酸基，n为2〜100的整数，优选为2〜20。 聚合物苯扎嗪化合物可用作金属电镀浴中的添加剂。 该方法包括以下步骤：a）将有效量的氨基化合物溶于甲酸溶液中; b）加入亚硝酸盐以重氮化氨基化合物; 和c）加入氨基磺酸以中和步骤b）中可能形成的任何过量的亚硝酸，由此产生聚合的苯扎嗪化合物。

公开(公告)号：US20130136869A1

公开(公告)日：2013-05-30

申请号：US13741446

申请日：2013-01-15

Applicant: MacDermid Acumen, Inc.

Inventor： Robert Hamilton ,  Ernest Long ,  Andrew M. Krol

IPC: B05D3/06

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract translation: 描述了一种处理其中分散有金属化合物的激光活化热塑性基材的方法。 将底物与含水组合物接触，所述水性组合物包含：（i）硫醇官能的有机化合物; （ii）乙氧基化醇表面活性剂; 和（iii）黄原胶。 通过使用处理组合物，当基板随后通过无电镀进行激光激活和电镀时，基本上消除了基板的外部电镀。

公开(公告)号：US20170051411A1

公开(公告)日：2017-02-23

申请号：US14831403

申请日：2015-08-20

Applicant: MacDermid Acumen, Inc.

Inventor： Jordan Kologe ,  Lei Jin ,  Ernest Long ,  Alexander Konefal ,  Wei Yan

IPC: C23C18/32 ,  H01L33/62 ,  H05K3/18 ,  C23C18/16 ,  C23C18/42

CPC classification number: C23C18/32 ,  C23C18/1641 ,  C23C18/1844 ,  C23C18/44

Abstract: An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath. The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).

Abstract translation: 介绍了一种无电镀银浴及其使用方法。 化学镀银浴被设计成仅在所需的金属基材上镀覆，同时防止电镀在不需要镀覆的区域上。 本发明在无电镀银浴中使用重金属基稳定剂来防止外部电镀。 控制电镀液中稳定剂量的能力允许消除外部电镀并允许稳定的浴。 化学镀银浴非常稳定，并以可接受的速度印版。 化学镀银浴通过使用如本文所述的稳定剂防止被电镀的下面的金属的腐蚀。 本文提供的镀银浴可用于各种应用，包括电子封装，集成电路（IC）和制造发光二极管（LED）中的应用。

公开(公告)号：US09067238B2

公开(公告)日：2015-06-30

申请号：US13741446

申请日：2013-01-15

Applicant: MacDermid Acumen, Inc.

Inventor： Robert Hamilton ,  Ernest Long ,  Andrew M. Krol

IPC: B05D1/18 ,  B05D3/00 ,  C08J7/18 ,  B05D3/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/38 ,  H05K3/18

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

公开(公告)号：US09040700B2

公开(公告)日：2015-05-26

申请号：US14181866

申请日：2014-02-17

Applicant: MacDermid Acumen, Inc.

Inventor： Andrew M. Krol ,  Ernest Long ,  Lev Taytsas

IPC: C07D241/46 ,  C08G73/06 ,  C25D3/38

CPC classification number: C08G73/0633 ,  C07D241/46 ,  C08G73/0694 ,  C25D3/38

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8, and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by a polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, Rx and Ry represent any combination of CH3, C2H5, and hydrogen, except that Rx and Ry cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.

Abstract translation: 制备具有以下通式的聚合物苯扎嗪化合物的方法：其中R1，R2，R4，R5，R6，R8和R9相同或不同，代表氢，低级烷基或取代芳基，R3以NH2 并重氮化后进行聚合，R 5和R 8可以代表单体或聚合苯氮鎓基，R 7是芳环中的碳，R x和R y表示CH 3，C 2 H 5和氢的任何组合，不同之处在于Rx和Ry不能同时 为氢，A为酸基，n为2〜100，优选为2〜20的整数。 聚合物苯扎嗪化合物可用作包含铜的金属电镀浴中的添加剂。 该方法包括以下步骤：a）将有效量的氨基化合物溶解在甲酸溶液中; b）加入亚硝酸盐以重氮化氨基化合物; 和c）加入氨基磺酸以中和步骤b）中可能形成的任何过量的亚硝酸，由此产生与使用现有技术方法制备的那些相比，残留在最终产物中的少量未反应单体的聚合苯扎嗪化合物。