公开(公告)号：US20210204412A1

公开(公告)日：2021-07-01

申请号：US17202745

申请日：2021-03-16

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  James Martin ,  Jason J. Carver

IPC: H05K3/42 ,  H05K3/00 ,  C25D5/54 ,  H05K3/38

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

公开(公告)号：US10986738B2

公开(公告)日：2021-04-20

申请号：US15973814

申请日：2018-05-08

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  James Martin ,  Jason J. Carver

IPC: C25D5/54 ,  C25D5/56 ,  C23C28/00 ,  H05K3/42 ,  H05K3/00 ,  H05K3/38

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.