公开(公告)号：US20210204412A1

公开(公告)日：2021-07-01

申请号：US17202745

申请日：2021-03-16

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  James Martin ,  Jason J. Carver

IPC: H05K3/42 ,  H05K3/00 ,  C25D5/54 ,  H05K3/38

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

公开(公告)号：US20220081776A1

公开(公告)日：2022-03-17

申请号：US17018004

申请日：2020-09-11

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards

IPC: C23C18/40 ,  C23C18/16

Abstract: An electroless copper deposition composition, comprising: (a) a source of copper ions; (b) a chelator; (c) a source of alkalinity; (d) a reducing agent; (e) nickel ions; (f) a bipyridine; (g) optionally, an additional stabilizer; and (h) optionally, a water soluble polymer. The electroless copper deposition composition can be used to deposit a ductile copper deposit on a substrate that exhibits high % elongation and high tensile strength.

公开(公告)号：US20210371998A1

公开(公告)日：2021-12-02

申请号：US16884314

申请日：2020-05-27

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  Emely Abel-Tatis

IPC: C25D3/48 ,  H05K3/18 ,  H05K3/46

Abstract: An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.

公开(公告)号：US20240158941A1

公开(公告)日：2024-05-16

申请号：US18418429

申请日：2024-01-22

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  Emely Abel-Tatis

IPC: C25D3/48 ,  H05K3/18 ,  H05K3/46

CPC classification number: C25D3/48 ,  H05K3/181 ,  H05K3/4661

Abstract: An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.

公开(公告)号：US10986738B2

公开(公告)日：2021-04-20

申请号：US15973814

申请日：2018-05-08

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  James Martin ,  Jason J. Carver

IPC: C25D5/54 ,  C25D5/56 ,  C23C28/00 ,  H05K3/42 ,  H05K3/00 ,  H05K3/38

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.