公开(公告)号：US07417523B2

公开(公告)日：2008-08-26

申请号：US10569127

申请日：2004-08-24

Applicant: Eberhard Waffenschmidt ,  Bernd Ackermann ,  Markus Wille

Inventor： Eberhard Waffenschmidt ,  Bernd Ackermann ,  Markus Wille

IPC: H01F5/00 ,  H01F7/06

CPC classification number: H05K1/165 ,  H01F27/362 ,  H01F2017/006 ,  H01F2017/0066 ,  H05K3/305 ,  H05K2201/086 ,  H05K2203/1572 ,  Y10T29/4902

Abstract: SMT-components known in the art usually have a thickness of approximately 1 mm and no flexibility. According to the present invention windings for an inductor are realized within a substrate, preferably by using copper layers which are already in the substrate. Then, thin metal sheet layers of high permeable material are laminated on top and bottom of the substrate. These layers are structured and then form the magnetic core of the inductor. Advantageously, an inductor may be provided with a very small building height.

Abstract translation: 本领域已知的SMT组件通常具有约1mm的厚度并且没有柔性。 根据本发明，用于电感器的绕组在衬底内实现，优选地通过使用已经在衬底中的铜层。 然后，将高透过性材料的金属薄片层压在基板的顶部和底部。 这些层被构造，然后形成电感器的磁芯。 有利地，电感器可以具有非常小的建筑物高度。

公开(公告)号：US20140022752A1

公开(公告)日：2014-01-23

申请号：US13599937

申请日：2012-08-30

Applicant: Markus Wille

Inventor： Markus Wille

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/142 ,  H05K3/36 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/1059 ,  Y10T29/49126

Abstract: Disclosed herein is a circuit board system comprising a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.

Abstract translation: 本文公开了一种电路板系统，其包括至少在部分上基本上是平面的载体电路板，其中载体电路板在一个或两侧具有至少一个刚性层铜包层或设置有导体轨道，其中至少一个基本上 与载体电路板并联排列的平面电路板模块布置成在载体电路板的相关凹槽中在至少一个刚性层铜包覆在一侧或两侧上或设置有导体轨道。 特别地，电路板模块被压入载体电路板中的凹槽中，并且电路板模块的边缘与相关联的凹部的边缘以摩擦锁定的方式接合以形成压配合。