公开(公告)号：US12132126B2

公开(公告)日：2024-10-29

申请号：US17836822

申请日：2022-06-09

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Richard Hamilton Sewell ,  Robert Woehl ,  Jens Dirk Moschner ,  Nils-Peter Harder

IPC: H01L31/044 ,  H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/022441 ,  H01L31/0682 ,  Y02E10/547

Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.