公开(公告)号：US20240250201A1

公开(公告)日：2024-07-25

申请号：US18586315

申请日：2024-02-23

Applicant: Maxeon Solar Pte. Ltd.

Inventor： PEI HSUAN LU ,  BENJAMIN I. HSIA ,  TAESEOK KIM

IPC: H01L31/18 ,  B23K26/382 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0236

CPC classification number: H01L31/18 ,  B23K26/382 ,  H01L31/022441 ,  H01L31/02168 ,  H01L31/02363 ,  H01L31/1804

Abstract: Local patterning and metallization of semiconductor structures using a laser beam, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a method of fabricating a solar cell includes providing a substrate having an intervening layer thereon. The method also includes locating a metal foil over the intervening layer. The method also includes exposing the metal foil to a laser beam, wherein exposing the metal foil to the laser beam forms openings in the intervening layer and forms a plurality of conductive contact structures electrically connected to portions of the substrate exposed by the openings.

公开(公告)号：US20240429335A1

公开(公告)日：2024-12-26

申请号：US18827492

申请日：2024-09-06

Applicant: Maxeon Solar Pte. Ltd.

Inventor： PEI HSUAN LU ,  TYLER D. NEWMAN ,  PAUL W. LOSCUTOFF ,  GEORGE G. CORREOS ,  YAFU LIN ,  ANDREA R. BOWRING ,  DAVID C. OKAWA ,  MATTHEW T. MATSUMOTO ,  BENJAMIN I. HSIA ,  ARBAZ AHMED SHAKIR ,  JOHN H. LIPPIATT ,  SIMONE I. NAZARETH ,  RYAN REAGAN ,  TODD R. JOHNSON ,  NED WESTERN ,  TAMIR LANCE ,  MARC ROBINSON

IPC: H01L31/05 ,  H01L31/02 ,  H01L31/18 ,  H02S40/34

Abstract: Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.

公开(公告)号：US20240250189A1

公开(公告)日：2024-07-25

申请号：US18625057

申请日：2024-04-02

Applicant: Maxeon Solar Pte. Ltd.

Inventor： PEI HSUAN LU ,  BENJAMIN I. HSIA ,  DAVID AARON R. BARKHOUSE ,  LEE GORNY

IPC: H01L31/02 ,  H01L31/0368 ,  H01L31/18

CPC classification number: H01L31/02008 ,  H01L31/03682 ,  H01L31/1804 ,  H01L31/186

Abstract: Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.