公开(公告)号：US20250169201A1

公开(公告)日：2025-05-22

申请号：US19030278

申请日：2025-01-17

Applicant: Maxeon Solar Pte. Ltd.

Inventor： DAVID D. SMITH ,  JEFFREY EL COTTER ,  DAVID AARON RANDOLPH BARKHOUSE ,  TAESEOK KIM

IPC: H10F19/80 ,  H10F10/174 ,  H10F71/00 ,  H10F77/20

Abstract: A solar cell, and methods of fabricating said solar cell, are disclosed. The solar cell can include a first emitter region over a substrate, the first emitter region having a perimeter around a portion of the substrate. A first conductive contact is electrically coupled to the first emitter region at a location outside of the perimeter of the first emitter region.

公开(公告)号：US20240250201A1

公开(公告)日：2024-07-25

申请号：US18586315

申请日：2024-02-23

Applicant: Maxeon Solar Pte. Ltd.

Inventor： PEI HSUAN LU ,  BENJAMIN I. HSIA ,  TAESEOK KIM

IPC: H01L31/18 ,  B23K26/382 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0236

CPC classification number: H01L31/18 ,  B23K26/382 ,  H01L31/022441 ,  H01L31/02168 ,  H01L31/02363 ,  H01L31/1804

Abstract: Local patterning and metallization of semiconductor structures using a laser beam, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a method of fabricating a solar cell includes providing a substrate having an intervening layer thereon. The method also includes locating a metal foil over the intervening layer. The method also includes exposing the metal foil to a laser beam, wherein exposing the metal foil to the laser beam forms openings in the intervening layer and forms a plurality of conductive contact structures electrically connected to portions of the substrate exposed by the openings.

公开(公告)号：US20240222534A1

公开(公告)日：2024-07-04

申请号：US18608788

申请日：2024-03-18

Applicant: Maxeon Solar Pte. Ltd.

Inventor： GABRIEL HARLEY ,  TAESEOK KIM ,  RICHARD HAMILTON SEWELL ,  MICHAEL MORSE ,  DAVID D. SMITH ,  MATTHIEU MOORS ,  JENS-DIRK MOSCHNER

IPC: H01L31/0224 ,  H01L31/0236 ,  H01L31/028 ,  H01L31/0475 ,  H01L31/05 ,  H01L31/068 ,  H01L31/0745

CPC classification number: H01L31/02245 ,  H01L31/022441 ,  H01L31/02363 ,  H01L31/028 ,  H01L31/0475 ,  H01L31/0512 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/50

Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

公开(公告)号：US20240088317A1

公开(公告)日：2024-03-14

申请号：US18513256

申请日：2023-11-17

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID FREDRIC JOEL KAVULAK ,  LEWIS ABRA ,  THOMAS P. PASS ,  TAESEOK KIM ,  MATTHIEU MOORS ,  BENJAMIN IAN HSIA ,  GABRIEL HARLEY

IPC: H01L31/05 ,  H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/0516 ,  H01L31/022441 ,  H01L31/022458 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0682 ,  Y02E10/50 ,  Y02E10/546 ,  Y02E10/547

Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

公开(公告)号：US20250081669A1

公开(公告)日：2025-03-06

申请号：US18939369

申请日：2024-11-06

Applicant: Maxeon Solar Pte. Ltd.

Inventor： TAESEOK KIM ,  DAVID SMITH

IPC: H01L31/02 ,  H01L31/0216 ,  H01L31/18

Abstract: Aligned metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor layer over a semiconductor substrate. A first plurality of discrete openings is in the semiconductor layer and exposes corresponding discrete portions of the semiconductor substrate. A plurality of doped regions is in the semiconductor substrate and corresponds to the first plurality of discrete openings. An insulating layer is over the semiconductor layer and is in the first plurality of discrete openings. A second plurality of discrete openings is in the insulating layer and exposes corresponding portions of the plurality of doped regions. Each one of the second plurality of discrete openings is entirely within a perimeter of a corresponding one of the first plurality of discrete openings. A plurality of conductive contacts is in the second plurality of discrete openings and is on the plurality of doped regions.

公开(公告)号：US20230238469A1

公开(公告)日：2023-07-27

申请号：US18114119

申请日：2023-02-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Matthieu Moors ,  DAVID D. SMITH ,  GABRIEL HARLEY ,  TAESEOK KIM

IPC: H01L31/061 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/068

CPC classification number: H01L31/061 ,  H01L31/068 ,  H01L31/1864 ,  H01L31/02167 ,  H01L31/022425 ,  Y02E10/547

Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.