公开(公告)号：US20230384251A1

公开(公告)日：2023-11-30

申请号：US18448044

申请日：2023-08-10

Applicant: Mesoline Inc.

Inventor： Marnix P. Rebergen ,  Michael D. Kelzenberg ,  Thomas C.R. Russell ,  Serhii Mytnyk

IPC: G01N27/12 ,  G01N33/00 ,  B22F7/08 ,  B22F3/00 ,  B41M3/00 ,  B41M7/00 ,  B22F3/105

CPC classification number: G01N27/128 ,  G01N27/127 ,  G01N33/0027 ,  B22F7/08 ,  B22F3/004 ,  B41M3/006 ,  B41M7/0081 ,  B22F3/105 ,  B22F2304/05

Abstract: Systems of electrical devices with high-resolution components and methods of fabricating the electrical devices using micro-molding processes are described. Small foot print electrical devices can be achieved by fabricating components with highly conductive materials, and with closely spaced components.