公开(公告)号：US20220159837A1

公开(公告)日：2022-05-19

申请号：US17508370

申请日：2021-10-22

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom ,  Wm. Todd Crandell

IPC: H05K1/11 ,  H05K1/14 ,  F21V19/00

Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

公开(公告)号：US20250008653A1

公开(公告)日：2025-01-02

申请号：US18670033

申请日：2024-05-21

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom ,  Wm. Todd Crandell

IPC: H05K1/11 ,  F21V19/00 ,  F21Y105/16 ,  F21Y115/10 ,  H01R12/72 ,  H05K1/02 ,  H05K1/14

Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

公开(公告)号：US20230250949A1

公开(公告)日：2023-08-10

申请号：US18160726

申请日：2023-01-27

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom

IPC: F21V29/74

CPC classification number: F21V29/74 ,  F21Y2115/10

Abstract: Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.

公开(公告)号：US12018829B2

公开(公告)日：2024-06-25

申请号：US18160726

申请日：2023-01-27

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom

IPC: F28F7/00 ,  F21V29/74 ,  F21Y115/10

CPC classification number: F21V29/74 ,  F21Y2115/10

Abstract: Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.

公开(公告)号：US20240410560A1

公开(公告)日：2024-12-12

申请号：US18670062

申请日：2024-05-21

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom

IPC: F21V29/74 ,  F21Y115/10

Abstract: Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.

公开(公告)号：US12016121B2

公开(公告)日：2024-06-18

申请号：US17508370

申请日：2021-10-22

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Brian Hillstrom ,  Wm. Todd Crandell

IPC: H05K1/11 ,  F21V19/00 ,  F21Y105/16 ,  F21Y115/10 ,  H01R12/72 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/117 ,  F21V19/001 ,  H01R12/721 ,  H05K1/0277 ,  H05K1/142 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05K2201/10106

Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.