公开(公告)号：US20130008875A1

公开(公告)日：2013-01-10

申请号：US13611619

申请日：2012-09-12

Applicant: Michael A. HUFF ,  Mehmet Ozgur

Inventor： Michael A. HUFF ,  Mehmet Ozgur

IPC: B23K26/38

CPC classification number: H01G5/145 ,  H01L28/60

Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.

Abstract translation: 公开了一种可变电容器件，其中电容调谐率和品质因数增加到非常高的水平，并且其中使用激光器将器件的电容值调整并保持在高精度和精度的期望值 在适当设计和制造的电容器装置上的微加工调谐过程。 可变电容器件的调谐可根据最终需要或期望的电容值的精度进行开环或闭环。 此外，可调谐到预定值之前可以在可变电容器件连接到电路之前执行，或者可以在可变电容器装置已经连接到电路中之后执行到期望值的调谐。

公开(公告)号：US20120281725A1

公开(公告)日：2012-11-08

申请号：US13549705

申请日：2012-07-16

Applicant: Michael A. HUFF ,  Jonah JACOB

Inventor： Michael A. HUFF ,  Jonah JACOB

IPC: H01L33/48 ,  H01S5/024

CPC classification number: H01S5/4025 ,  H01L2224/83192 ,  H01L2924/1461 ,  H01S5/02256 ,  H01S5/02264 ,  H01S5/024 ,  H01S5/02423 ,  H01S5/02484 ,  H01S5/0425 ,  H01L2924/00

Abstract: A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.

Abstract translation: 公开了一种激光二极管系统，其中由含有激光二极管的半导体材料制成的衬底被结合到由金属材料制成的衬底上，而不使用两个衬底之间的任何中间接合或焊接层。 金属衬底用作激光二极管半导体衬底的电极和/或散热器。 微通道可以包括在金属基板中以允许冷却剂流体通过，从而有助于从激光二极管基板去除热量。 包括冷却流体微通道的第二金属衬底也可以结合到激光二极管衬底以提供来自激光二极管衬底的更大的热传递。 低温下的基板的结合以及对基板表面的修改结合使得能够在粘合的基板之间实现低电阻界面和低热阻界面。

公开(公告)号：US20110309553A1

公开(公告)日：2011-12-22

申请号：US13098867

申请日：2011-05-02

Applicant: Michael A. HUFF

Inventor： Michael A. HUFF

IPC: B29B13/08

CPC classification number: B23K28/02 ,  B23K17/00 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/1224 ,  B23K26/348 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B81C2201/0143 ,  B81C2900/00 ,  H01J37/3056 ,  H01J2237/31713 ,  H01J2237/31749 ,  Y10S977/84 ,  Y10S977/888 ,  Y10S977/889 ,  Y10S977/901

Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam. Alternatively, a close-loop control system can be used with one laser or ion beam that is controlled and operated by the close-loop control system so as to achieve the predetermined levels of machining resolution and precision and machining rates for the predetermined application.

Abstract translation: 公开了一种用于微机电系统（MEMS），纳米机电系统（NEMS），微型模型，纳米系统，光子学，3-D集成，异构集成和纳米技术装置和结构的精密制造的系统和方法 。 所公开的系统和方法也可以用于任何制造技术，以增加与常规实施方式相比正在制造的装置和结构的精度和精度。 平台在加工过程中保持和移动待加工的基板，并且提供多个激光和/或离子束，其能够实现预定应用的预定水平的加工分辨率和精度和加工速率。 多个激光器和/或离子束包括多个相同类型的激光和/或离子束。 或者，可以使用由闭环控制系统控制和操作的一个激光器或离子束来使用闭环控制系统，以实现预定应用的预定级别的加工分辨率和精度和加工速率。

公开(公告)号：US20110250706A1

公开(公告)日：2011-10-13

申请号：US13074487

申请日：2011-03-29

Applicant: Michael A. HUFF

Inventor： Michael A. HUFF

IPC: H01L21/66 ,  G06F17/50

CPC classification number: B81C99/006

Abstract: An improved method for the fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Photonics, Nanotechnology, 3-Dimensional Integration, Micro- and Nano-Fabricated Devices and Systems for both rapid prototyping development and manufacturing is disclosed. The method includes providing a plurality of different standardized and repeatable process modules usable in fabricating the devices and systems, defining a process sequence for fabricating a predefined one of the devices or systems, and identifying a series of the process modules that are usable in performing the defined process sequence and thus in fabricating the predefined device or system.

Abstract translation: 用于快速成型开发的微机电系统（MEMS），纳米机电系统（NEMS），光子学，纳米技术，三维集成，微纳米制造设备和系统的改进方法 并且公开了制造。 该方法包括提供多个不同的标准化和可重复的过程模块，可用于制造设备和系统，定义用于制造设备或系统中的预定义设备的过程序列，以及识别可用于执行设备和系统的一系列过程模块 并且因此在制造预定义的装置或系统中。