公开(公告)号：US5112230A

公开(公告)日：1992-05-12

申请号：US728460

申请日：1991-07-11

Applicant: Michael J. DeSimone

Inventor： Michael J. DeSimone

IPC: H05K1/00

CPC classification number: H05K1/0293 ,  H05K1/029 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0195 ,  H05K2203/175 ,  Y10T29/49156

Abstract: A reconfigurable substrate is provided for supporting electrical elements. A conductive strip is disposed on the substrate for linking at least two electrical elements. The substrate has a portion has a portion proximate to the strip for permitting subsequent removal thereof, thereby severing the conductive strip. Thus, a connection of electrical elements may be selectively varied as a function of specification of options which become operative by subsequent removal of a portion of the substrate proximate to the conductive strip.

Abstract translation: 提供了用于支撑电气元件的可重新配置的基板。 导电带设置在基板上用于连接至少两个电气元件。 衬底具有一部分靠近条带的部分，以允许随后的去除，从而切断导电条。 因此，电气元件的连接可以根据选项的规格的选择而有选择地变化，这些选项通过随后移除靠近导电带的基板的一部分而变得有效。