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公开(公告)号:US09866200B2
公开(公告)日:2018-01-09
申请号:US14883400
申请日:2015-10-14
Applicant: Microchip Technology Incorporated
Inventor: Wan-Thai Hsu , John Ryan Clark
CPC classification number: H03H9/2431 , B81B2201/0271 , H03H9/02244 , H03H9/02259 , H03H9/02338 , H03H9/2452 , H03H2009/02251 , H03H2009/02283 , H03H2009/02307 , H03H2009/0233 , H03H2009/02346 , H03H2009/02496
Abstract: A multiple coil spring MEMS resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring. The number of coil springs, the length and the width of the coil springs and the weight of the outer ring are selected to realize a desired resonant frequency.
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公开(公告)号:US09923545B2
公开(公告)日:2018-03-20
申请号:US14883435
申请日:2015-10-14
Applicant: Microchip Technology Incorporated
Inventor: John Ryan Clark
CPC classification number: H03H9/2405 , H02N1/008 , H03H9/02244 , H03H9/2431 , H03H9/2452 , H03H2009/02251 , H03H2009/02283 , H03H2009/02307 , H03H2009/0233 , H03H2009/02496
Abstract: A compound spring MEMS resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor. The resonator body further includes masses attached to the open ends of the compound spring block and capacitively coupled to drive/sense electrodes. The dimensions of the spring unit cells, the number of spring unit cells for a compound spring block, the size and weight of the masses, and the length and width of the support beams are selected to realize a desired resonant frequency. Meanwhile, the number of compound spring blocks is selected to tune the desired electrical characteristics, such as impedance, of the MEMS resonator.
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