公开(公告)号：US20150369684A1

公开(公告)日：2015-12-24

申请号：US14310881

申请日：2014-06-20

Applicant: Microlux Technology, Inc.

Inventor： Tom T. Nguyen ,  Cuong D. Nguyen

IPC: G01L19/00

CPC classification number: G01L19/0084 ,  G01L19/142

Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.

Abstract translation: 压力传感器封装，其包括：附接到连接到补偿支撑件的互连壳体的压力传感器支架; 其中：（a）压力传感器装置附接到所述压力传感器支撑件并且电连接到设置在所述压力传感器支撑件上的焊盘; （b）补偿电路连接到补偿支撑件，并且电连接到设置在补偿支撑件上的焊盘; （c）设置在互连壳体的壁中的通孔中的连接器电连接到压力传感器支撑件上的焊盘和补偿支撑件上的焊盘; 和（d）压力端口设置在压力传感器支架中。

公开(公告)号：US20150219517A1

公开(公告)日：2015-08-06

申请号：US14170387

申请日：2014-01-31

Applicant: Microlux Technology, Inc.

Inventor： Tom T. Nguyen

IPC: G01L19/14

CPC classification number: G01L19/143 ,  G01L19/142 ,  G01L19/145

Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.

Abstract translation: 具有密封装置的一部分（例如但不限于）具有MEMS传感器的部分的密封件的装置。

公开(公告)号：US20150217416A1

公开(公告)日：2015-08-06

申请号：US14170355

申请日：2014-01-31

Applicant: Microlux Technology, Inc.

Inventor： Tom T. Nguyen

IPC: B23P11/00 ,  B23P19/04

CPC classification number: G01D11/245 ,  B23P11/005 ,  B81B7/0032 ,  B81B2201/0264 ,  B81C1/00261 ,  B81C3/00 ,  B81C2203/019 ,  G01D11/26 ,  G01L5/165 ,  G01L19/0672 ,  G01L19/14 ,  G01L19/145 ,  G12B9/06 ,  H01L23/10 ,  Y10T29/49872 ,  Y10T29/49874 ,  Y10T29/49913 ,  Y10T29/49915

Abstract: Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Abstract translation: 用于制造气密密封件以密封装置的一部分的方法，例如但不限于具有MEMS传感器的部分。 一种这样的方法使用压接装置来压缩形成在壳体中的空腔中的密封件，该密封件包括附接到应力隔离器的MEMS传感器。 在这种压缩状态下，密封件变形成密封密封应力隔离器内部，外部和底部的表面。