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公开(公告)号:US20220084858A1
公开(公告)日:2022-03-17
申请号:US17456338
申请日:2021-11-23
Applicant: Micron Technology, Inc.
Inventor: David Palsulich , Nicholas A. Wieber
Abstract: A method of contaminant detection comprises exposing a wafer comprising one or more contaminants to microdroplets of an oxidizer to form an oxide on a surface of the wafer, exposing the oxide to an etchant to remove the oxide and leave the one or more contaminants on the surface of the wafer, and determining a composition of the one or more contaminants. Additional methods and related tools are also disclosed.
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公开(公告)号:US11742230B2
公开(公告)日:2023-08-29
申请号:US17456338
申请日:2021-11-23
Applicant: Micron Technology, Inc.
Inventor: David Palsulich , Nicholas A. Wieber
CPC classification number: H01L21/67288 , H01J49/105 , H01L21/0206 , H01L21/02164 , H01L21/02236 , H01L22/12
Abstract: A method of contaminant detection comprises exposing a wafer comprising one or more contaminants to microdroplets of an oxidizer to form an oxide on a surface of the wafer, exposing the oxide to an etchant to remove the oxide and leave the one or more contaminants on the surface of the wafer, and determining a composition of the one or more contaminants. Additional methods and related tools are also disclosed.
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公开(公告)号:US11211272B2
公开(公告)日:2021-12-28
申请号:US16582420
申请日:2019-09-25
Applicant: Micron Technology, Inc.
Inventor: David Palsulich , Nicholas A. Wieber
Abstract: A method of contaminant detection comprises exposing a wafer comprising one or more contaminants to microdroplets of an oxidizer to form an oxide on a surface of the wafer, exposing the oxide to an etchant to remove the oxide and leave the one or more contaminants on the surface of the wafer, and determining a composition of the one or more contaminants. Additional methods and related tools are also disclosed.
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公开(公告)号:US20210090920A1
公开(公告)日:2021-03-25
申请号:US16582420
申请日:2019-09-25
Applicant: Micron Technology, Inc.
Inventor: David Palsulich , Nicholas A. Wieber
Abstract: A method of contaminant detection comprises exposing a wafer comprising one or more contaminants to microdroplets of an oxidizer to form an oxide on a surface of the wafer, exposing the oxide to an etchant to remove the oxide and leave the one or more contaminants on the surface of the wafer, and determining a composition of the one or more contaminants. Additional methods and related tools are also disclosed.
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