公开(公告)号：US20250141566A1

公开(公告)日：2025-05-01

申请号：US18498439

申请日：2023-10-31

Applicant: Microsoft Technology Licensing, LLC

Inventor： Maria Leena Kyllikki VIITANIEMI ,  Christian L. BELADY ,  Teresa A. NICK ,  Winston Allen SAUNDERS ,  Nicholas Andrew KEEHN ,  Eric C. PETERSON ,  Vaidehi ORUGANTI ,  Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA

IPC: H04B10/80 ,  G02B6/35

Abstract: A computing device may include a substrate. A computing device may include a processing unit supported by the substrate. A computing device may include an optical transmitter supported by the substrate and in electrical communication with the processing unit.

公开(公告)号：US20240405879A1

公开(公告)日：2024-12-05

申请号：US18412283

申请日：2024-01-12

Applicant: Microsoft Technology Licensing, LLC

Inventor： Vaidehi ORUGANTI ,  Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA ,  Christian L. BELADY

IPC: H04B10/50

Abstract: An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

公开(公告)号：US20240403522A1

公开(公告)日：2024-12-05

申请号：US18204042

申请日：2023-05-31

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA ,  Vaidehi ORUGANTI ,  Maria Leena Kyllikki VIITANIEMI ,  Winston Allen SAUNDERS

IPC: G06F30/28 ,  G06F1/20 ,  G06F30/17

Abstract: A system may model a thermal management demand of a heat-generating component on an outer surface of the heat-generating component as a heat generation map. A system may select an initial channel design based on the heat generation map. A system may evaluate the initial channel design, wherein evaluated metrics include at least pressure drop and thermal resistance of the channel design. A system may change at least one parameter of the initial channel design based on the evaluated metrics to create a refined channel design. A system may form at least one thermal element in or on the outer surface of the heat-generating component according to the refined channel design.

公开(公告)号：US20230422435A1

公开(公告)日：2023-12-28

申请号：US17848755

申请日：2022-06-24

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA ,  Christian L. BELADY ,  Sean Michael JAMES ,  Vaidehi ORUGANTI

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20263 ,  H05K7/20272 ,  G06F1/206 ,  H01M8/184

Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

公开(公告)号：US20230403821A1

公开(公告)日：2023-12-14

申请号：US17840338

申请日：2022-06-14

Applicant: Microsoft Technology Licensing, LLC

Inventor： Vaidehi ORUGANTI ,  Christian L. BELADY ,  Husam ALISSA ,  Bharath RAMAKRISHNAN ,  Ruslan NAGIMOV

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20809

Abstract: Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

公开(公告)号：US20230156960A1

公开(公告)日：2023-05-18

申请号：US17525536

申请日：2021-11-12

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA ,  Eric C. PETERSON ,  Nicholas Andrew KEEHN ,  Christian L. BELADY ,  Ioannis MANOUSAKIS ,  Dennis TRIEU

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20236 ,  H05K7/20818 ,  H05K7/20781

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

公开(公告)号：US20220369493A1

公开(公告)日：2022-11-17

申请号：US17320063

申请日：2021-05-13

Applicant: Microsoft Technology Licensing, LLC

Inventor： Husam Atallah ALISSA ,  Bharath RAMAKRISHNAN ,  Ioannis MANOUSAKIS ,  Nicholas Andrew KEEHN ,  Eric Clarence PETERSON

IPC: H05K7/20

Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.

公开(公告)号：US20240347421A1

公开(公告)日：2024-10-17

申请号：US18133443

申请日：2023-04-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Vaidehi ORUGANTI ,  Bharath RAMAKRISHNAN ,  Husam Atallah ALISSA ,  Christian L. BELADY

IPC: H01L23/473 ,  H01L23/522

CPC classification number: H01L23/473 ,  H01L23/5226

Abstract: A processing unit includes a substrate, an electrical load, and a microfluidic volume. The electrical load is supported by the first surface of the substrate, and the microfluidic volume is positioned in the second surface of the substrate. The processing unit includes a first electrode positioned in the microfluidic volume and a second electrode positioned in the microfluidic volume. A first TSV connects the first electrode to the electrical load, and a second TSV connects the second electrode to the electrical load. An electrochemical fluid is positioned in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load.

公开(公告)号：US20240314977A1

公开(公告)日：2024-09-19

申请号：US18120861

申请日：2023-03-13

Applicant: Microsoft Technology Licensing, LLC

Inventor： Nicholas Andrew KEEHN ,  Husam Atallah ALISSA ,  Bharath RAMAKRISHNAN ,  Vaidehi ORUGANTI ,  Ioannis MANOUSAKIS

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/20381

Abstract: A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.

公开(公告)号：US20240107716A1

公开(公告)日：2024-03-28

申请号：US17953834

申请日：2022-09-27

Applicant: Microsoft Technology Licensing, LLC

Inventor： Ehsan NASR AZADANI ,  Bharath RAMAKRISHNAN ,  Nicholas Andrew KEEHN ,  Husam Atallah ALISSA ,  Ruslan NAGIMOV ,  Eric C. PETERSON

IPC: H05K7/20 ,  H01M10/44 ,  H01M10/613 ,  H01M10/63 ,  H01M10/6567

CPC classification number: H05K7/20836 ,  H01M10/44 ,  H01M10/613 ,  H01M10/63 ,  H01M10/6567 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20818 ,  H01M2220/10

Abstract: A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partially in the HP container and partially in the LP container. The two-phase working fluid has a vapor phase and a liquid phase. A pump is configured to move the working fluid through the system, and a condenser is configured to condense the vapor phase of the working fluid into the liquid phase.