公开(公告)号：US20180254566A1

公开(公告)日：2018-09-06

申请号：US15449808

申请日：2017-03-03

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Flavio Protasio Ribeiro ,  Michael David Dickey ,  Collin Alexander Ladd ,  Andrew Lewis Fassler

IPC: H01R3/08 ,  H01R12/61 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H05K3/28 ,  H05K3/10 ,  H05K3/34

CPC classification number: H01R3/08 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/5389 ,  H01L24/69 ,  H01L24/89 ,  H01R12/613 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K3/10 ,  H05K3/28 ,  H05K3/34 ,  H05K2201/05 ,  H05K2201/10977

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

公开(公告)号：US20180201010A1

公开(公告)日：2018-07-19

申请号：US15409372

申请日：2017-01-18

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery ,  Andrew Lewis Fassler ,  Collin Alexander Ladd

IPC: B41F15/08 ,  B41F17/38

CPC classification number: B41F15/0868 ,  B41F17/38 ,  B41M1/12 ,  B41M3/006 ,  B41N1/24 ,  B41N1/247 ,  H05K3/1225 ,  H05K3/1233 ,  H05K2203/0139 ,  H05K2203/0143

Abstract: Examples are disclosed that relate to screen printing liquid metal materials. One example provides a method to deposit a metal pattern onto a substrate. The method includes placing a textile over the substrate, the textile having a plurality of pores wettable by a liquid metal. The method further includes forcing the liquid metal through the pores of the textile and onto the substrate, and separating the substrate and textile.

公开(公告)号：US11841280B2

公开(公告)日：2023-12-12

申请号：US17249170

申请日：2021-02-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Benjamin Sullivan ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd ,  Kelly Marie Bogan

IPC: G01K7/04 ,  A41D1/00 ,  A61B5/01 ,  G01K3/14 ,  A61B5/00 ,  A63B71/00 ,  G01K1/14

CPC classification number: G01K7/04 ,  A41D1/002 ,  A61B5/015 ,  A61B5/6804 ,  A63B71/00 ,  G01K1/14 ,  G01K3/14 ,  A41D2500/30 ,  A63B2230/50 ,  G01K2213/00

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

公开(公告)号：US10302460B2

公开(公告)日：2019-05-28

申请号：US15611141

申请日：2017-06-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Matija Varga ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd

IPC: G01D5/241 ,  A61B5/00 ,  A61B5/11 ,  G01P15/125 ,  H01G5/013 ,  G01C9/18

Abstract: Described herein is a sensor including a sensing electrode structure and a motion-responsive structure in capacitive communication with the sensing electrode structure, the sensing electrode structure and the motion-responsive structure being separated by a first dielectric layer, the motion-responsive structure comprising a liquid metal mass within a matrix in which the liquid metal mass is movable based upon movement of the sensor, and the sensing electrode structure comprising a first electrode, and a second electrode spaced from the first electrode to form a capacitor.

公开(公告)号：US10935436B2

公开(公告)日：2021-03-02

申请号：US15647080

申请日：2017-07-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Benjamin Sullivan ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd ,  Kelly Marie Bogan

IPC: G01K3/00 ,  G01K7/04 ,  G01K3/14 ,  A41D1/00 ,  A61B5/01 ,  A61B5/00 ,  A63B71/00 ,  G01K1/14

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

公开(公告)号：US10355371B2

公开(公告)日：2019-07-16

申请号：US15449808

申请日：2017-03-03

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Flavio Protasio Ribeiro ,  Michael David Dickey ,  Collin Alexander Ladd ,  Andrew Lewis Fassler

IPC: H01R3/08 ,  H01R12/61 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H05K3/28 ,  H05K3/10 ,  H05K3/34 ,  H01L23/498 ,  H01L23/538

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.