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公开(公告)号：US10327332B2
公开(公告)日：2019-06-18
申请号：US15287563
申请日：2016-10-06
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC: H05K1/03 , C08K3/08 , C08K7/00 , C09D5/24 , C09D183/04 , G06F1/16 , H01L23/538 , H05K1/09 , H05K3/00 , H05K1/02 , H05K3/28 , H05K1/14
Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US09930773B2
公开(公告)日：2018-03-27
申请号：US15188453
申请日：2016-06-21
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey
CPC classification number: H05K1/0272 , G06F1/1613 , H01R12/59 , H01R12/77 , H05K1/028 , H05K1/0281 , H05K1/03 , H05K1/092 , H05K1/148 , H05K3/10 , H05K3/1275 , H05K3/361 , H05K3/4644 , H05K2201/032 , H05K2201/0338 , H05K2201/0391 , H05K2201/055 , H05K2201/09009 , H05K2201/09736 , H05K2203/0776
Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.
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公开(公告)号：US20190239351A1
公开(公告)日：2019-08-01
申请号：US16381708
申请日：2019-04-11
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC: H05K1/03 , C08K7/00 , H05K3/00 , H05K1/09 , H01L23/538 , C09D183/04 , G06F1/16 , C08K3/08 , H05K1/02 , H05K3/28 , C09D5/24
CPC classification number: H05K1/0393 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2201/001 , C08K2201/011 , C09D5/24 , C09D183/04 , G06F1/1669 , H01L23/5386 , H01L23/5387 , H05K1/028 , H05K1/0313 , H05K1/09 , H05K1/148 , H05K3/0014 , H05K3/285 , H05K2201/0245 , H05K2201/026 , H05K2201/0391 , H05K2203/0776
Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US20180254566A1
公开(公告)日：2018-09-06
申请号：US15449808
申请日：2017-03-03
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Flavio Protasio Ribeiro , Michael David Dickey , Collin Alexander Ladd , Andrew Lewis Fassler
IPC: H01R3/08 , H01R12/61 , H01L23/00 , H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/28 , H05K3/10 , H05K3/34
CPC classification number: H01R3/08 , H01L23/4985 , H01L23/49866 , H01L23/5389 , H01L24/69 , H01L24/89 , H01R12/613 , H05K1/028 , H05K1/09 , H05K1/111 , H05K1/18 , H05K3/10 , H05K3/28 , H05K3/34 , H05K2201/05 , H05K2201/10977
Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.
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公开(公告)号：US09872390B1
公开(公告)日：2018-01-16
申请号：US15239645
申请日：2016-08-17
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
CPC classification number: H05K1/14 , H01L21/486 , H01L23/49872 , H01L23/5387 , H05K1/0283 , H05K1/0296 , H05K1/0393 , H05K3/107 , H05K3/28 , H05K2201/032 , H05K2201/0391 , H05K2201/10977 , H05K2203/1305
Abstract: One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.
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Patent Agency Ranking
公开(公告)号：US11219124B2
公开(公告)日：2022-01-04
申请号：US16381708
申请日：2019-04-11
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC: H05K1/03 , H05K1/02 , H05K3/28 , C08K3/08 , C08K7/00 , C09D5/24 , C09D183/04 , G06F1/16 , H01L23/538 , H05K1/09 , H05K3/00 , H05K1/14
Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US10725002B2
公开(公告)日：2020-07-28
申请号：US15723094
申请日：2017-10-02
Applicant: Microsoft Technology Licensing, LLC
Inventor： Asta Jane Roseway , Bichlien Hoang Nguyen , Hsin-Liu Kao , Michael David Dickey , Vikram Reddy Dendi
Abstract: Described herein are systems and methods for coupling environmental hazard detection and actuation of a wearable chemical sensor at a molecular level. The chemical sensor may be a wearable chemical sensor implemented as a powder, cream, lacquer or other wearable construct. The wearable chemical sensor may detect exposure to various environmental hazards and provide an analog means (e.g., a range of color changes) of indicating the level of environmental hazard exposure.
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公开(公告)号：US20180103544A1
公开(公告)日：2018-04-12
申请号：US15287563
申请日：2016-10-06
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC: H05K1/03 , C09D183/04 , C09D5/24 , C08K7/00 , C08K3/08 , H01L23/538 , G06F1/16 , H05K1/09 , H05K3/00
CPC classification number: H05K1/0393 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2201/001 , C08K2201/011 , C09D5/24 , C09D183/04 , G06F1/1669 , H01L23/5386 , H01L23/5387 , H05K1/028 , H05K1/0313 , H05K1/09 , H05K1/148 , H05K3/0014 , H05K3/285 , H05K2201/0245 , H05K2201/026 , H05K2201/0391 , H05K2203/0776
Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US10355371B2
公开(公告)日：2019-07-16
申请号：US15449808
申请日：2017-03-03
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Flavio Protasio Ribeiro , Michael David Dickey , Collin Alexander Ladd , Andrew Lewis Fassler
IPC: H01R3/08 , H01R12/61 , H01L23/00 , H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/28 , H05K3/10 , H05K3/34 , H01L23/498 , H01L23/538
Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.
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公开(公告)号：US20170367179A1
公开(公告)日：2017-12-21
申请号：US15188453
申请日：2016-06-21
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey
CPC classification number: H05K1/0272 , G06F1/1613 , H01R12/59 , H01R12/77 , H05K1/028 , H05K1/0281 , H05K1/03 , H05K1/092 , H05K1/148 , H05K3/10 , H05K3/1275 , H05K3/361 , H05K3/4644 , H05K2201/032 , H05K2201/0338 , H05K2201/0391 , H05K2201/055 , H05K2201/09009 , H05K2201/09736 , H05K2203/0776
Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.
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