公开(公告)号：US20230375822A1

公开(公告)日：2023-11-23

申请号：US17750009

申请日：2022-05-20

Applicant: Microsoft Technology Licensing, LLC

Inventor： Xiao Chuan ONG ,  Di SUN ,  Joseph Michael LUIZZI ,  Wyatt Owen DAVIS

IPC: G02B26/08 ,  B81B7/00 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B7/007 ,  G02B26/101 ,  B81B2201/042 ,  B81B2203/058 ,  B81B2203/04 ,  B81B2207/098

Abstract: A flip chip micromirror assembly comprising a micromirror chip that is flip chip mounted onto the circuit board via a bonding layer. The micromirror chip has a micromirror layer in which a micromirror is formed. The micromirror chip has a flip chip surface facing the electrode surface of the circuit board. The bonding layer includes conductive region(s) that electrically couples corresponding board electrodes with corresponding chip electrodes. However, the bonding layer is not interposed between the electrode surface of the circuit board and the micromirror itself. In other words, the bonding layer spaces the micromirror chip from the circuit board, and provides a gap underneath the micromirror between the micromirror chip and the circuit board. This gap is of sufficient thickness that the micromirror can be actuated with full movement without being mechanically obstructed by the circuit board.

公开(公告)号：US20240160009A1

公开(公告)日：2024-05-16

申请号：US18054886

申请日：2022-11-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Di SUN ,  Xiao Chuan ONG ,  Seungwoo LEE ,  Wyatt Owen DAVIS

IPC: G02B26/10

CPC classification number: G02B26/105

Abstract: A method includes forming a mirror assembly for a scanning device that includes a mirror rotationally supported by flexible beams, the mirror assembly also including a piezoelectric material. The mirror is encased with a cover having a top scanning opening aligned with the mirror to form a scanning assembly. An interior of the scanning assembly is coated with a protective film. Etching is performed through the top scanning opening to remove the protective film from a top of the mirror.

公开(公告)号：US20230314792A1

公开(公告)日：2023-10-05

申请号：US17711639

申请日：2022-04-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Di SUN ,  Xiao Chuan ONG ,  Matthew David ELLIS ,  Wyatt Owen DAVIS

IPC: G02B26/08 ,  G02B26/10 ,  B05D1/32 ,  B05D1/02

CPC classification number: G02B26/0858 ,  B05D1/02 ,  B05D1/32 ,  G02B26/10

Abstract: A device includes a mirror coupled via a pair of flexible beams supported by a block of semiconductor material that has a cavity about the mirror and beams to allow the mirror to rotate about an axis along the beams. A piezoresistive sensor is coupled to one of the beams to provide information representative of an angle of rotation of the mirror. A light blocking shield covers exposed portions of the block of semiconductor material about the mirror.