公开(公告)号：US20220374052A1

公开(公告)日：2022-11-24

申请号：US17761906

申请日：2020-09-18

Applicant: Microsoft Technology Licensing, LLC

Inventor： Han LI ,  Masaaki FUKUMOTO ,  Nathan Michael THOME ,  James David HOLBERY ,  Paul Christopher KOS

IPC: G06F1/16

Abstract: A method of controlling opening resistance in an electronic device includes maintaining the electronic device in a closed state via a resistive force, wherein the resistive force is applied by at least one of: a hinge of the electronic device, and magnets of the electronic device. The method further includes using a sensor on an underside of the electronic device to detect a force applied to a first portion of the electronic device and determining that the force corresponds to a user initiating opening of the electronic device. In accordance with the determination, the method further includes reducing the resistive force to assist the user in opening the electronic device.

公开(公告)号：US20240373608A1

公开(公告)日：2024-11-07

申请号：US18773280

申请日：2024-07-15

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin LEE ,  Bo DAN ,  Han LI

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/28

Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

公开(公告)号：US20230345687A1

公开(公告)日：2023-10-26

申请号：US17660789

申请日：2022-04-26

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin LEE ,  Bo DAN ,  Han LI

IPC: H05K9/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K9/0088 ,  H05K1/0216 ,  H05K3/284 ,  H05K2203/1322

Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

公开(公告)号：US20190141846A1

公开(公告)日：2019-05-09

申请号：US15807343

申请日：2017-11-08

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kanth KURUMADDALI ,  Kenneth Charles BOMAN ,  David John HUSTON ,  Han LI

IPC: H05K5/02 ,  H05K3/30 ,  H05K5/00 ,  H05K13/00 ,  H05K13/08

CPC classification number: H05K5/0217 ,  G06F1/1658 ,  G06F1/183 ,  G06F1/184 ,  H05K3/305 ,  H05K5/0017 ,  H05K7/1417 ,  H05K13/0015 ,  H05K13/08 ,  H05K2201/10537 ,  H05K2203/104

Abstract: An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

公开(公告)号：US20200381337A1

公开(公告)日：2020-12-03

申请号：US16428820

申请日：2019-05-31

Applicant: Microsoft Technology Licensing, LLC

Inventor： Lincoln Matthew GHIONI ,  Brian J. TOLENO ,  Sahar VILAN ,  Han LI ,  Bo DAN

IPC: H01L23/427 ,  H01L21/48 ,  F28D15/02

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

公开(公告)号：US20190001654A1

公开(公告)日：2019-01-03

申请号：US15639581

申请日：2017-06-30

Applicant: Microsoft Technology Licensing, LLC

Inventor： James Michael BONICATTO ,  Han LI ,  David John HUSTON ,  James David HOLBERY ,  Siyuan MA

IPC: B32B43/00 ,  B32B41/00

CPC classification number: B32B43/006 ,  B32B41/00 ,  B32B2315/08 ,  B32B2457/208 ,  G02F2001/133331 ,  G02F2202/28 ,  G06F1/1637 ,  G06F3/0412 ,  Y10S156/924 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

公开(公告)号：US20230354569A1

公开(公告)日：2023-11-02

申请号：US18221239

申请日：2023-07-12

Applicant: Microsoft Technology Licensing, LLC

Inventor： Zhicong YAO ,  Han LI ,  Scott Douglas BOWERS ,  Massood NIKKHAH ,  Joseph Benjamin GAULT

IPC: H05K9/00 ,  H05K5/00 ,  B29C45/00 ,  B32B5/20

CPC classification number: H05K9/0081 ,  H05K5/0017 ,  B29C45/0001 ,  B32B5/20 ,  H05K9/002 ,  H05K9/0084 ,  B29K2055/02

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

公开(公告)号：US20210161038A1

公开(公告)日：2021-05-27

申请号：US16856989

申请日：2020-04-23

Applicant: Microsoft Technology Licensing, LLC

Inventor： Zhicong YAO ,  Han LI ,  Scott Douglas BOWERS ,  Massood NIKKHAH ,  Joseph Benjamin GAULT

IPC: H05K9/00 ,  H05K5/00 ,  B32B5/20 ,  B29C45/00

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

公开(公告)号：US20200024763A1

公开(公告)日：2020-01-23

申请号：US16043098

申请日：2018-07-23

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： Bo DAN ,  Robert Ullman MYERS ,  Han LI ,  James Hao-An Chen LIN ,  Andrew HILL

IPC: C25D1/02 ,  G06F17/50

Abstract: Systems and methods are described, and one method includes storing a PCB dimension, a vapor chamber (VC) case configuration, a package height of a heat-generating (HG) device, a component data identifying a height of a component, and a layout configuration data indicating locations for the HG device and the component. Upon determining the component location is an interfering location, the VC case configuration data is updated to indicate an inner clearance perimeter for the VC case, surrounding the interfering location. Electroforming forms the VC, for thermal coupling to the HG device, having a VC case with rimless, seamless outer peripheral surfaces aligned and facing according to the VC case outer perimeter, and other rimless surfaces aligned and facing, relative to the clearance perimeter, to form a clearance.