ELECTROMAGNETIC RADIOFREQUENCY TRAP
    1.
    发明公开

    公开(公告)号:US20240088858A1

    公开(公告)日:2024-03-14

    申请号:US17943770

    申请日:2022-09-13

    CPC classification number: H03H1/0007 H03H7/0115 H03H7/0153 H03H7/1758

    Abstract: A radiofrequency trap component system includes a resonant LC circuit including a capacitive element and an inductive element, wherein the inductive element includes primary inductor rings positioned in proximity to a modulation ring. The radio frequency trap component system further includes a radiofrequency noise detector configured to detect a noise level of radiofrequency noise interacting with an electromagnetic radiofrequency noise recipient in a computing device and controller circuitry communicatively coupled to the radiofrequency noise detector and configured to determine that the detected noise level satisfies an interference condition and to tune a radiofrequency bandwidth at which the resonant LC circuit resonates by modulating electrical current supplied to the modulation ring of the inductive element in the resonant LC circuit, based at least on determining that the detected noise level satisfies the interference condition.

    THREADED FASTENER RETENTION DETECTION
    2.
    发明公开

    公开(公告)号:US20230361513A1

    公开(公告)日:2023-11-09

    申请号:US17739945

    申请日:2022-05-09

    CPC classification number: H01R13/6683 H01R12/7047

    Abstract: Portable electronic devices by their nature are designed to be regularly physically repositioned and relocated, which can cause significant mechanical stresses on internal components, including printed circuit boards (PCBs). This is particularly true when a portable electronic device is handled roughly. These significant mechanical stresses can cause threaded mechanical fasteners securing the PCBs to become dislodged. A dislodged threaded mechanical fastener may contact electrically conductive features of the PCB or other internal components, thereby causing a ground fault or short. At a minimum, this may cause the portable electronic device to not work well, or at all. Further, this may cause the portable electronic device to overheat and become a fire hazard. The presently disclosed technology detects if the threaded mechanical fasteners within a portable electronic device become dislodged. A user of the portable electronic device may then be warned, and the portable electronic device may be powered down.

    CHANGING A MOBILE DEVICE FEATURE SET UPON DETECTING ATTACHMENT OF A CASE

    公开(公告)号:US20240396988A1

    公开(公告)日:2024-11-28

    申请号:US18322822

    申请日:2023-05-24

    Abstract: Examples are disclosed that relate to a mobile device configured to change a feature set in response to detecting that a case is attached to the mobile device. One example provides a method enacted on a mobile device. The method comprises operating the mobile device with a first feature set. The first feature set comprises one or more features enabled when a case is not attached to the mobile device. The method further comprises detecting that the case is attached to the mobile device and an identity of the case by using a magnetic sensor. The method further comprises operating the mobile device with a second feature set that is different from the first feature set in response to detecting that the case is attached to the mobile device. The second feature set is selected based upon the identity of the case.

    CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

    公开(公告)号:US20240373608A1

    公开(公告)日:2024-11-07

    申请号:US18773280

    申请日:2024-07-15

    Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

    SELF-ALIGNING MAGNETIC ANTENNA FEED CONNECTION

    公开(公告)号:US20230378631A1

    公开(公告)日:2023-11-23

    申请号:US17748135

    申请日:2022-05-19

    CPC classification number: H01Q1/1207 H01Q1/241 H01Q21/28 H01Q9/0414

    Abstract: An electronic communication device communicates a radiofrequency communication signal between wireless communication circuitry and an antenna structure. The antenna structure may be mounted on a first component support structure and configured to communicate wireless radiofrequency signals. A first connector may be connected to the antenna structure. A second component support structure may be mechanically coupled to the first component support structure and capable of movement with respect to the first component support structure. Wireless communication circuitry may be mounted on the second component support structure configured to communicate with the antenna structure using radiofrequency carrier signals. A second connector may be connected to the wireless communication circuitry. The first connector and the second connector may be mechanically connected and resiliently aligned by magnetic attraction therebetween and communicatively coupled to communicate the radiofrequency carrier signal between the wireless communication circuitry and the antenna structure.

    CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

    公开(公告)号:US20230345687A1

    公开(公告)日:2023-10-26

    申请号:US17660789

    申请日:2022-04-26

    CPC classification number: H05K9/0088 H05K1/0216 H05K3/284 H05K2203/1322

    Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

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