公开(公告)号：US20090163152A1

公开(公告)日：2009-06-25

申请号：US12329181

申请日：2008-12-05

Applicant: Mike Jiang

Inventor： Mike Jiang

IPC: H04B1/38

CPC classification number: H05K1/141 ,  H05K1/024 ,  H05K1/034 ,  H05K1/0373 ,  H05K1/142 ,  H05K2201/0209 ,  H05K2201/045 ,  H05K2201/09145 ,  H05K2201/10166 ,  H05K2203/167

Abstract: This description discloses a circuit board for a power amplifier that is able to keep a low temperature. In an example embodiment, the circuit board includes: an input board on its substrate, an output board on its substrate, and a power amplifier transistor acting as a bridge to connect the input board and the output board with each other. The substrate of the input board is made from a first kind of material, and the substrate of the output board is made from a second kind of material. The second kind of material has different performance (e.g., relatively better performance for both RF and heat dissipation) than that of the first kind of material. Moreover, this description discloses a power amplifier on the circuit board, a dual radio unit board having such a power amplifier, and a radio base station having such a dual radio unit board.

Abstract translation: 本说明书公开了能够保持低温的功率放大器的电路板。 在一个示例性实施例中，电路板包括：在其衬底上的输入板，其衬底上的输出板，以及充当用于将输入板和输出板彼此连接的桥的功率放大器晶体管。 输入板的基板由第一种材料制成，输出板的基板由第二种材料制成。 第二种材料具有与第一种材料不同的性能（例如，RF和散热的相对更好的性能）。 此外，该说明书公开了电路板上的功率放大器，具有这种功率放大器的双无线电单元板和具有这种双重无线电单元板的无线电基站。