公开(公告)号：US10951116B2

公开(公告)日：2021-03-16

申请号：US16367179

申请日：2019-03-27

Applicant: Monolithic Power Systems, Inc.

Inventor： Chao Liu ,  Daocheng Huang ,  Cong Deng

IPC: H02M3/156 ,  H02M3/158 ,  H02M1/00

Abstract: A voltage regulator has a switching circuit and a control circuit. The switching circuit provides an output voltage and an output current. The control circuit provides a switching control signal to the switching circuit to adjust the output voltage, such that the output voltage decreases with a first slope as the output current increases when the output current is less than a predetermined current, the output voltage decreases with a second slope as the output current increases when the output current is larger than the predetermined current.

公开(公告)号：US20190305674A1

公开(公告)日：2019-10-03

申请号：US16367179

申请日：2019-03-27

Applicant: Monolithic Power Systems, Inc.

Inventor： Chao Liu ,  Daocheng Huang ,  Cong Deng

IPC: H02M3/04 ,  H02M1/00

Abstract: A voltage regulator has a switching circuit and a control circuit. The switching circuit provides an output voltage and an output current. The control circuit provides a switching control signal to the switching circuit to adjust the output voltage, such that the output voltage decreases with a first slope as the output current increases when the output current is less than a predetermined current, the output voltage decreases with a second slope as the output current increases when the output current is larger than the predetermined current.

公开(公告)号：US20250096209A1

公开(公告)日：2025-03-20

申请号：US18469800

申请日：2023-09-19

Applicant: Monolithic Power Systems, Inc.

Inventor： Ting Ge ,  Yingjiang Pu ,  Hunt Hang Jiang ,  Daocheng Huang ,  Yuanfeng Zhou ,  Qian Li ,  Cong Deng ,  Zhe Yang ,  Wenyang Huang

IPC: H01L25/16 ,  H01F27/06 ,  H01F27/08 ,  H01F27/26 ,  H01F37/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.