-
公开(公告)号：US20240224477A1
公开(公告)日：2024-07-04
申请号：US18090734
申请日：2022-12-29
Applicant: Monolithic Power Systems, Inc.
Inventor： Daocheng Huang , Xu Han , Zhe Yang
Abstract: A power module includes a first power module and a second power module arranged below the first power module. The first power module includes at least one input pad configured to receive an input voltage and at least one power pad configured to provide an intermediate voltage. The at least one input pad is mounted on a top surface of the first power module, and the at least one power pad is mounted on a bottom surface of the first power module. The second power module includes at least one signal pad configured to receive the intermediate voltage and at least one output pad configured to provide an output voltage. The at least one signal pad is mounted on a top surface of the second power module, and the at least one output pad is mounted on a bottom surface of the second power module.
-
公开(公告)号：US12040711B2
公开(公告)日：2024-07-16
申请号：US17737755
申请日：2022-05-05
Applicant: MONOLITHIC POWER SYSTEMS, INC.
Inventor： Zhe Yang , Daocheng Huang , Faisal Ahmad , Odai Alsmadi
CPC classification number: H02M3/158 , H02M1/0009
Abstract: A multiphase converter provides an output voltage to a load. The multiphase converter receives a load event signal from the load and turns ON at a same time the phases of the multiphase converter to increase the output voltage in response to the load event signal indicating that a load current drawn by the load from the multiphase converter is about to increase. The multiphase converter increases an impedance of low-side switches of the multiphase converter in response to the load event signal indicating that the load current is about to decrease.
-
公开(公告)号：US20250096209A1
公开(公告)日：2025-03-20
申请号：US18469800
申请日：2023-09-19
Applicant: Monolithic Power Systems, Inc.
Inventor： Ting Ge , Yingjiang Pu , Hunt Hang Jiang , Daocheng Huang , Yuanfeng Zhou , Qian Li , Cong Deng , Zhe Yang , Wenyang Huang
Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.
-
公开(公告)号：US20250095902A1
公开(公告)日：2025-03-20
申请号：US18469847
申请日：2023-09-19
Applicant: Monolithic Power Systems, Inc.
Inventor： Ting Ge , Daocheng Huang , Zhe Yang , Wenyang Huang
Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.
-
-
-
Search Results
4
records
(took 0.016 seconds)
