公开(公告)号：US20090020867A1

公开(公告)日：2009-01-22

申请号：US12168438

申请日：2008-07-07

Applicant: Yoshiharu OGATA ,  Yoshikatsu SOMA ,  Hiroharu KONDO ,  Munehide SAIMEN

Inventor： Yoshiharu OGATA ,  Yoshikatsu SOMA ,  Hiroharu KONDO ,  Munehide SAIMEN

IPC: H01L23/36

CPC classification number: H01L23/3675 ,  H01L23/4006 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2224/32225

Abstract: A semiconductor device, includes: a wiring substrate having a wiring pattern on a front surface thereof; a first semiconductor chip mounted on the front surface of the wiring substrate; a first heat radiator having a first recess housing the first semiconductor chip and making contact with the front surface of the wiring substrate and the first semiconductor chip directly or with a first insulation layer; a second heat radiator making contact with a rear surface of the wiring substrate directly or with a second insulation layer; and a first fixing member passing through the first heat radiator, the wiring substrate, and the second heat radiator, and pressing the first heat radiator and the second heat radiator to the wiring substrate.

Abstract translation: 一种半导体器件，包括：布线基板，其前表面具有布线图案; 安装在所述布线基板的前表面上的第一半导体芯片; 第一散热器，其具有容纳所述第一半导体芯片的第一凹部，并且与所述布线基板的前表面和所述第一半导体芯片直接或与第一绝缘层接触; 第二散热器直接或与第二绝缘层与布线基板的后表面接触; 以及通过所述第一散热器，所述布线基板和所述第二散热器的第一固定构件，并且将所述第一散热器和所述第二散热器按压到所述布线基板。

公开(公告)号：US20080078491A1

公开(公告)日：2008-04-03

申请号：US11856776

申请日：2007-09-18

Applicant: Munehide SAIMEN

Inventor： Munehide SAIMEN

IPC: B32B37/10 ,  B32B37/12

CPC classification number: B32B37/003 ,  B32B37/12 ,  B32B2457/08 ,  H01L21/4857 ,  H01L23/49572 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/068 ,  Y10T156/10 ,  H01L2924/00

Abstract: A method for manufacturing a wiring substrate having a sheet, including: (a) arranging a wiring substrate and a sheet between a board and a tool in a manner that a resin layer comes between the wiring substrate and the sheet, one surface of the wiring substrate being a concave/convex surface and the other surface being flat, and both surfaces of the sheet being flat; (b) pressing the wiring substrate, the resin layer, and the sheet using the board and the tool so as to adhere the resin layer to both the wiring substrate and the sheet, in that: the board having a flat surface is arranged in a manner that the flat surface faces the tool; the tool contains an elastic body having a projecting part projecting in a direction of the board; the resin layer is arranged so as to overlap with a concave part and a convex part of the concave/convex surface; and the pressing step (b) starts with a tip of the projecting part of the tool and the flat surface of the board and proceeds while expanding a pressing surface of the tool by widening a tip plane of the projecting part using deformation of the elastic body.

Abstract translation: 一种制造具有片材的布线基板的方法，包括：（a）以布线基板和片材之间的树脂层布置布线基板和板之间的布线基板和片材，布线的一个表面 基板是凹凸表面，另一个表面是平坦的，并且该表面的两个表面是平的; （b）使用所述基板和所述工具将所述布线基板，所述树脂层和所述片材按压，以将所述树脂层粘合到所述布线基板和所述片材上，其特征在于，所述具有平坦表面的所述板布置在 平面面向工具的方式; 该工具包括具有沿板的方向突出的突出部分的弹性体; 树脂层被布置成与凹/凸表面的凹部和凸部重叠; 并且按压步骤（b）从工具的突出部分的尖端和板的平坦表面开始，并且通过使弹性体的变形扩大突起部的尖端平面而使工具的按压面膨胀 。

公开(公告)号：US20110122356A1

公开(公告)日：2011-05-26

申请号：US12947032

申请日：2010-11-16

Applicant: Munehide SAIMEN

Inventor： Munehide SAIMEN

IPC: G02F1/1345

CPC classification number: H05K1/0269 ,  G02F1/13452 ,  H05K3/361 ,  H05K2201/09918 ,  H05K2203/166

Abstract: An electro-optical device includes an electro-optical panel including a pair of first panel alignment marks having a first shape and a pair of second panel alignment marks having a second shape; a first circuit substrate provided with a first circuit substrate alignment mark which is represented by the first shape in plan view; and a second circuit substrate provided with a second circuit substrate alignment mark which is represented by the second shape in plan view.

Abstract translation: 电光装置包括电光面板，其包括具有第一形状的一对第一面板对准标记和具有第二形状的一对第二面板对准标记; 第一电路基板，设置有在俯视图中由第一形状表示的第一电路基板对准标记; 以及第二电路基板，其设置有在俯视图中由第二形状表示的第二电路基板对准标记。