公开(公告)号：US20090020867A1

公开(公告)日：2009-01-22

申请号：US12168438

申请日：2008-07-07

Applicant: Yoshiharu OGATA ,  Yoshikatsu SOMA ,  Hiroharu KONDO ,  Munehide SAIMEN

Inventor： Yoshiharu OGATA ,  Yoshikatsu SOMA ,  Hiroharu KONDO ,  Munehide SAIMEN

IPC: H01L23/36

CPC classification number: H01L23/3675 ,  H01L23/4006 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2224/32225

Abstract: A semiconductor device, includes: a wiring substrate having a wiring pattern on a front surface thereof; a first semiconductor chip mounted on the front surface of the wiring substrate; a first heat radiator having a first recess housing the first semiconductor chip and making contact with the front surface of the wiring substrate and the first semiconductor chip directly or with a first insulation layer; a second heat radiator making contact with a rear surface of the wiring substrate directly or with a second insulation layer; and a first fixing member passing through the first heat radiator, the wiring substrate, and the second heat radiator, and pressing the first heat radiator and the second heat radiator to the wiring substrate.

Abstract translation: 一种半导体器件，包括：布线基板，其前表面具有布线图案; 安装在所述布线基板的前表面上的第一半导体芯片; 第一散热器，其具有容纳所述第一半导体芯片的第一凹部，并且与所述布线基板的前表面和所述第一半导体芯片直接或与第一绝缘层接触; 第二散热器直接或与第二绝缘层与布线基板的后表面接触; 以及通过所述第一散热器，所述布线基板和所述第二散热器的第一固定构件，并且将所述第一散热器和所述第二散热器按压到所述布线基板。

公开(公告)号：US20080078491A1

公开(公告)日：2008-04-03

申请号：US11856776

申请日：2007-09-18

Applicant: Munehide SAIMEN

Inventor： Munehide SAIMEN

IPC: B32B37/10 ,  B32B37/12

CPC classification number: B32B37/003 ,  B32B37/12 ,  B32B2457/08 ,  H01L21/4857 ,  H01L23/49572 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/068 ,  Y10T156/10 ,  H01L2924/00

Abstract: A method for manufacturing a wiring substrate having a sheet, including: (a) arranging a wiring substrate and a sheet between a board and a tool in a manner that a resin layer comes between the wiring substrate and the sheet, one surface of the wiring substrate being a concave/convex surface and the other surface being flat, and both surfaces of the sheet being flat; (b) pressing the wiring substrate, the resin layer, and the sheet using the board and the tool so as to adhere the resin layer to both the wiring substrate and the sheet, in that: the board having a flat surface is arranged in a manner that the flat surface faces the tool; the tool contains an elastic body having a projecting part projecting in a direction of the board; the resin layer is arranged so as to overlap with a concave part and a convex part of the concave/convex surface; and the pressing step (b) starts with a tip of the projecting part of the tool and the flat surface of the board and proceeds while expanding a pressing surface of the tool by widening a tip plane of the projecting part using deformation of the elastic body.

Abstract translation: 一种制造具有片材的布线基板的方法，包括：（a）以布线基板和片材之间的树脂层布置布线基板和板之间的布线基板和片材，布线的一个表面 基板是凹凸表面，另一个表面是平坦的，并且该表面的两个表面是平的; （b）使用所述基板和所述工具将所述布线基板，所述树脂层和所述片材按压，以将所述树脂层粘合到所述布线基板和所述片材上，其特征在于，所述具有平坦表面的所述板布置在 平面面向工具的方式; 该工具包括具有沿板的方向突出的突出部分的弹性体; 树脂层被布置成与凹/凸表面的凹部和凸部重叠; 并且按压步骤（b）从工具的突出部分的尖端和板的平坦表面开始，并且通过使弹性体的变形扩大突起部的尖端平面而使工具的按压面膨胀 。

公开(公告)号：US07316939B2

公开(公告)日：2008-01-08

申请号：US10985668

申请日：2004-11-11

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/78 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/4985 ,  H01L21/67092 ,  H01L24/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0052 ,  H05K3/0064 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y10T83/869

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; cutting the terminals along a boundary between the first region and the second region; and continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 沿着第一区域和第二区域之间的边界切割端子; 并且沿着所述第一区域和所述第二区域之间的边界，将所述加强构件从内侧连续切割到所述外侧。

公开(公告)号：US20060102382A1

公开(公告)日：2006-05-18

申请号：US11247612

申请日：2005-10-10

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H05K1/00 ,  H05K3/20

CPC classification number: H05K3/0052 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0058 ,  H05K2201/09063 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y10T29/49128 ,  Y10T29/49789 ,  H01L2924/00

Abstract: A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern provided on a first surface of the base substrate, a reinforcement member provided on a second surface of the base substrate, and the through hole which is positioned so as to overlap partially an end of the reinforcement member and which extends through the base substrate.

Abstract translation: 一种电子部件的制造方法，其特征在于，包括：沿着与通孔相交的线分割布线基板，所述布线基板具有： 基底基板，设置在基底基板的第一表面上的布线图案，设置在基底基板的第二表面上的加强部件和定位成部分地与加强部件的端部重叠的通孔， 延伸穿过基底。

公开(公告)号：US20050194693A1

公开(公告)日：2005-09-08

申请号：US10985667

申请日：2004-11-11

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L21/60 ,  H01L23/48 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L24/86 ,  H01L2224/7565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0064 ,  H05K2201/10681 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49789 ,  Y10T29/49835

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the terminals in the wiring substrate, thereby cutting the terminals along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从布线基板中具有端子的表面侧穿孔，从而沿着第一区域和第二区域之间的边界切割端子; 从布线基板的具有加强部件的表面侧穿孔，从而沿着第一区域与第二区域之间的边界从内侧向外侧连续切割加强部件。

公开(公告)号：US08640582B2

公开(公告)日：2014-02-04

申请号：US12350775

申请日：2009-01-08

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: B26F1/02 ,  B26D5/00

CPC classification number: H05K3/0052 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/005 ,  H05K2201/09918 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/163 ,  Y10T83/0467 ,  Y10T83/0572 ,  Y10T83/141 ,  Y10T83/178 ,  Y10T83/541 ,  Y10T83/6484

Abstract: A method for manufacturing a flexible substrate includes punching out a flexible substrate from a flexible tape wherein the flexible substrate has a first contour that is a part of a contour of the flexible substrate, and a second contour that is a remaining portion of the contour other than the first contour, and requires a punching accuracy lower than a punching accuracy of the first contour. The method includes the steps of: operating a first die by a control section to punch out the first contour from the flexible tape; judging by the control section as to whether a punching accuracy of the first contour meets a standard; and operating a second die by the control section to punch out the second contour from the flexible tape thereby separating the flexible substrate from the flexible tape when the control section judges that the punching accuracy of the first contour meets the standard, and not operate the second die when the control section judges that the punching accuracy of the first contour does not meet the standard.

Abstract translation: 一种制造柔性基板的方法包括从柔性带冲出柔性基板，其中柔性基板具有作为柔性基板的轮廓的一部分的第一轮廓，以及作为轮廓其他部分的第二轮廓 比第一轮廓高，并且要求冲压精度低于第一轮廓的冲孔精度。 该方法包括以下步骤：通过控制部分操作第一模具以从柔性带上冲出第一轮廓; 由控制部判断第一轮廓的冲孔精度是否满足标准; 并且通过所述控制部分操作第二模具以从所述柔性胶带冲出所述第二轮廓，从而当所述控制部分判断所述第一轮廓的冲裁精度满足所述标准时将所述柔性基板与所述柔性带分离，并且不操作所述第二轮廓 当控制部判定第一轮廓的冲裁精度不符合标准时，会死亡。

公开(公告)号：US07582955B2

公开(公告)日：2009-09-01

申请号：US11998357

申请日：2007-11-29

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L23/495

CPC classification number: H05K3/0052 ,  H01L24/86 ,  H01L2224/7565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0064 ,  H05K2201/10681 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49789 ,  Y10T29/49835

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the terminals in the wiring substrate, thereby cutting the terminals along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从布线基板中具有端子的表面侧穿孔，从而沿着第一区域和第二区域之间的边界切割端子; 从布线基板的具有加强部件的表面侧穿孔，从而沿着第一区域与第二区域之间的边界从内侧向外侧连续切割加强部件。

公开(公告)号：US20090197111A1

公开(公告)日：2009-08-06

申请号：US12365636

申请日：2009-02-04

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: B32B15/16 ,  B23K31/00

CPC classification number: H05K3/363 ,  G02F1/13452 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10T428/12569 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

Abstract translation: 一种制造用于将设置在电光面板上的第一端子部分电连接到基板的第二端子部分的电光装置的方法包括将包含由低熔点材料制成的导电颗粒的各向异性导电粘合剂涂覆到 或者是第一端子部分或第二端子部分，并且通过在第二端子部分与第一端子部分的热压接合中通过施加热量来熔化导电颗粒而通过共晶接合将第一端子部分与第二端子部分电连接， 各向异性导电粘合剂。

公开(公告)号：US07282389B2

公开(公告)日：2007-10-16

申请号：US10985666

申请日：2004-11-11

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L21/00

CPC classification number: H01L24/86 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0393 ,  H05K3/005 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/2009 ,  H05K2203/1545

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby cutting the terminals along the boundary between the first region and the second region.

Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从配线基板的具有加强构件的表面侧穿孔，从而沿着第一区域和第二区域之间的边界从内侧向外侧连续切割加强构件; 从布线基板的具有加强部件的表面侧穿过，从而沿着第一区域和第二区域之间的边界切断端子。

公开(公告)号：US20050186702A1

公开(公告)日：2005-08-25

申请号：US10985666

申请日：2004-11-11

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L29/40 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01L24/86 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0393 ,  H05K3/005 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/2009 ,  H05K2203/1545

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby cutting the terminals along the boundary between the first region and the second region.

Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从配线基板的具有加强构件的表面侧穿孔，从而沿着第一区域和第二区域之间的边界从内侧向外侧连续切割加强构件; 从布线基板的具有加强部件的表面侧穿过，从而沿着第一区域和第二区域之间的边界切断端子。