公开(公告)号：US20170171980A1

公开(公告)日：2017-06-15

申请号：US15444425

申请日：2017-02-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Masaru TAKAHASHI ,  Choichiro FUJII ,  Hirobumi ADACHI

IPC: H05K1/18 ,  H01G4/12 ,  H01G4/005 ,  H01G4/30 ,  H01G4/228

CPC classification number: H05K1/185 ,  H01G4/005 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10378

Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

公开(公告)号：US20160128199A1

公开(公告)日：2016-05-05

申请号：US14928136

申请日：2015-10-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaru TAKAHASHI ,  Choichiro FUJII

IPC: H05K1/18 ,  H01G4/30 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01G2/106 ,  H01G4/224 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/122 ,  Y02P70/611

Abstract: A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

Abstract translation: 内置电子部件基板包括芯基板，通过接合部件安装在芯基板的一个主表面上的电子部件和包含嵌入其中的电子部件的树脂层。 电子部件是包括陶瓷多层体的多层陶瓷电容器和包括端面部的第一外部电极和包括设置在陶瓷多层体的端面上的端面部的第二外部电极。 树脂层与第一外部电极和接合部件的端面部之间设置有第一间隙，在第二外部电极和接合部件的树脂层与端面部之间设置第二间隙。