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公开(公告)号：US20250008647A1
公开(公告)日：2025-01-02
申请号：US18830893
申请日：2024-09-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHIO , Ryutatsu MIZUKAMI
IPC: H05K1/02
Abstract: In a multilayer substrate, one of a first reference conductor layer and a second reference conductor layer overlapping an eleventh interlayer connection conductor includes a first opening overlapping a signal conductor layer when viewed in a Z-axis direction. When viewed in the Z-axis direction, the first opening is positioned in a negative direction of an X axis relative to a vicinity of a first reference straight line connecting a second interlayer connection conductor and a fifth interlayer connection conductor. When viewed in the Z-axis direction, the first opening is positioned in a positive direction of the X axis relative to the eleventh interlayer connection conductor.
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公开(公告)号：US20230327309A1
公开(公告)日：2023-10-12
申请号：US18201211
申请日：2023-05-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Noriaki OKUDA , Kosuke NISHIO
IPC: H01P3/08
Abstract: A transmission line includes an element body, a signal conductor layer, and a ground conductor layer. The element body includes an insulator layer. The signal conductor layer is below the insulator layer, and the ground conductor layer is above the insulator layer in an element body up-down direction. A hole is located at a surface of the insulator layer and penetrates the insulator layer in the element body up-down direction. At least a portion of the hole overlaps the signal conductor layer when viewed in the element body up-down direction. The hole extends between a left hole-defining surface and a right hole-defining surface. In a cross section orthogonal to the element body front-back direction, the left hole-defining surface includes a left upper end and a left lower end in the element body left-right direction, and the right hole-defining surface includes a right upper end and a right lower end in the element body left-right direction.
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公开(公告)号：US20230299452A1
公开(公告)日：2023-09-21
申请号：US18200011
申请日：2023-05-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Noriaki OKUDA , Kosuke NISHIO , Keisuke ARAKI
IPC: H01P3/08
CPC classification number: H01P3/08
Abstract: In a transmission line, a multilayer body includes a hollow portion above a signal conductor layer and below a ground conductor layer and overlapping the ground conductor layer when viewed in an up-down direction, and a spacer facing the hollow portion. In a cross section orthogonal to a front-back direction, an overlapping region is a region in the hollow portion in which the hollow portion overlaps the spacer in the up-down direction. In a cross section orthogonal to the front-back direction, a non-overlapping region is a region in the hollow portion in which the hollow portion does not overlap the spacer in the up-down direction. A length of the hollow portion in the up-down direction in the overlapping region is shorter than a length of the hollow portion in the up-down direction in the non-overlapping region.
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公开(公告)号：US20230291086A1
公开(公告)日：2023-09-14
申请号：US18198473
申请日：2023-05-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Noriaki OKUDA , Kosuke NISHIO , Masanori OKAMOTO , Kentarou KAWABE
Abstract: In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.
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公开(公告)号：US20230284381A1
公开(公告)日：2023-09-07
申请号：US18196523
申请日：2023-05-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHIO
CPC classification number: H05K1/0298 , H05K1/0313 , H05K1/0277 , H05K3/0017 , H05K3/46 , H05K2201/0141 , H05K2201/0129 , H05K2203/06
Abstract: A multilayer substrate includes laminated insulating layers each including a main surface on which a conductor is provided. The multilayer substrate also includes a signal line defined by the conductors, and a shield conductor defined by the conductors. The shield conductor includes an opening and a portion overlapping the signal line in plan view. At least one of the insulating layers includes a void that communicates with the opening and that is larger than the opening in plan view.
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Patent Agency Ranking
公开(公告)号：US20230036907A1
公开(公告)日：2023-02-02
申请号：US17963230
申请日：2022-10-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noriaki OKUDA , Tomohiro NAGAI , Kosuke NISHIO
Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.
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公开(公告)号：US20220418103A1
公开(公告)日：2022-12-29
申请号：US17898548
申请日：2022-08-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi KASUYA , Tomohiko NARUOKA , Noriaki OKUDA , Kosuke NISHIO , Nobuo IKEMOTO
Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.
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公开(公告)号：US20240292535A1
公开(公告)日：2024-08-29
申请号：US18651724
申请日：2024-05-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHIO
CPC classification number: H05K1/115 , H05K1/0393 , H05K2201/0141 , H05K2201/015 , H05K2201/096
Abstract: A multilayer board in which interlayer connection conductors include one or more first interlayer connection conductors in a first region and passing through any of a first insulator layer, a second insulator layer, and a third insulator layer in an up-down direction and a second interlayer connection conductor located in a second region and passing through the third insulator layer in the up-down direction. The second interlayer connection conductor is joined to a conductor and a second conductor layer. An area of the second interlayer connection conductor viewed in the up-down direction is larger than a minimum value of areas of the one or more first interlayer connection conductors viewed in the up-down direction.
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公开(公告)号：US20240275015A1
公开(公告)日：2024-08-15
申请号：US18637608
申请日：2024-04-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHIO
IPC: H01P3/08
CPC classification number: H01P3/08
Abstract: A transmission line includes an insulator including at least one insulator layer, and first and second conductor patterns located in or on the insulator layer and arranged at positions different from each other in a thickness direction of the insulator layer. The first conductor pattern includes a first signal line and a second signal line each extending along a signal transmission direction. The second conductor pattern includes a first counter electrode and a second counter electrode. The first counter electrode overlaps the first signal line but does not overlap the second signal line when viewed in the thickness direction. The second counter electrode overlaps the second signal line but does not overlap the first signal line when viewed in the thickness direction.
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公开(公告)号：US20240008168A1
公开(公告)日：2024-01-04
申请号：US18225273
申请日：2023-07-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHIO
CPC classification number: H05K1/0242 , H05K1/028 , H01P3/081 , H05K2201/09263 , H05K2201/09672 , H05K2201/0129 , H05K2201/09681
Abstract: When viewed in an up-down direction, a first line-shaped reference conductor layer extends along a first signal conductor layer such that portions thereof overlap. When viewed in the up-down direction, the first line-shaped reference conductor layer meanders such that one or more first projecting portions projecting from the first signal conductor layer in a first orthogonal direction and one or more second projecting portions projecting from the first signal conductor layer in a second orthogonal direction alternate in a transmission direction. A section of at least one or more first pairs of projecting portions excluding both ends thereof is not connected to a conductor layer other than one or more of the one or more first projecting portions and one or more of the one or more second projecting portions included in the at least one or more first pairs of projecting portions.
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