公开(公告)号：US20180069168A1

公开(公告)日：2018-03-08

申请号：US15795579

申请日：2017-10-27

Applicant: Murata Manufacturing Co, Ltd.

Inventor： SHINSUKE IKEUCHI ,  KANSHO YAMAMOTO ,  TAKUO HADA ,  YOICHI MOCHIDA ,  HIDEYA HORIUCHI

IPC: H01L41/09 ,  H01L41/107 ,  H01L41/314 ,  H01L41/187

CPC classification number: H01L41/09 ,  H01L41/044 ,  H01L41/0471 ,  H01L41/083 ,  H01L41/107 ,  H01L41/187 ,  H01L41/31 ,  H01L41/314 ,  H04R17/00 ,  H04R2201/003

Abstract: A piezoelectric device that includes a base member having an opening therein and an upper layer supported by the base member. The upper layer includes a vibration portion at a location corresponding to the opening in the base member. The vibration portion includes a lower electrode, an intermediate electrode and an upper electrode that are spaced apart from one another in a thickness direction of the piezoelectric device. The upper layer includes a first piezoelectric layer disposed so as to be at least partially sandwiched between the lower electrode and the intermediate electrode, and a second piezoelectric layer disposed so as to overlap with the first piezoelectric layer and so as to be at least partially sandwiched between the intermediate electrode and the upper electrode. The first piezoelectric layer and the second piezoelectric layer are different in relative permittivity in the thickness direction of the piezoelectric device.

公开(公告)号：US20170309808A1

公开(公告)日：2017-10-26

申请号：US15638861

申请日：2017-06-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TAKUO HADA ,  Kansho Yamamoto

IPC: H01L41/09 ,  H01L41/33 ,  H01L41/113 ,  H01L41/253 ,  H04R31/00 ,  H04R17/10

CPC classification number: H01L41/09 ,  B81B2201/0271 ,  B81B2201/032 ,  B81C1/00682 ,  H01L41/094 ,  H01L41/0973 ,  H01L41/113 ,  H01L41/253 ,  H01L41/33 ,  H04R17/00 ,  H04R17/10 ,  H04R31/006 ,  H04R2201/003

Abstract: A method for manufacturing a piezoelectric device that includes a substrate and a vibration portion that can include a membrane or a beam that is directly or indirectly supported by the substrate and arranged above the substrate. Moreover, the vibration portion includes a piezoelectric layer and the method includes forming the vibration portion and adjusting a resonance frequency of the vibration portion by locally subjecting a region including the vibration portion to heat treatment.