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公开(公告)号:US20190190546A1
公开(公告)日:2019-06-20
申请号:US16285408
申请日:2019-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi TANAKA , Kazuo WATANABE , Tetsuaki ADACHI , Masahito NUMANAMI , Yasuhisa YAMAMOTO
CPC classification number: H04B1/005 , H04L25/02 , H04W72/0453 , H04W88/06 , H04W88/08
Abstract: A communication unit includes the following elements. A first transmit circuit outputs a first signal or a second signal from a first input signal. A first amplifier amplifies the first signal and outputs a first amplified signal. A first signal generating circuit generates a third signal having a frequency higher than a frequency of the second signal, based on the second signal and a first reference signal. A first filter circuit receives the third signal and allows one of a frequency component representing a sum of the frequency of the second signal and a frequency of the first reference signal and a frequency component representing a difference therebetween to pass through the first filter circuit and attenuates the other one of the frequency components. A second amplifier amplifies the third signal output from the first filter circuit and outputs a second amplified signal.
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公开(公告)号:US20190131941A1
公开(公告)日:2019-05-02
申请号:US16168977
申请日:2018-10-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shota ISHIHARA , Hiroshi OKABE , Yasuhisa YAMAMOTO
Abstract: A power amplifier circuit includes a power amplifier, first and second filters, and first and second output paths. The power amplifier is able to amplify both of a first signal and a second signal. The frequency of the second signal is higher than that of the first signal. The first filter includes a first inductor and attenuates the second signal amplified in the power amplifier. The first inductor serves as a path for the first signal amplified in the power amplifier. The second filter includes a first capacitor and attenuates the first signal amplified in the power amplifier. The first capacitor serves as a path for the second signal amplified in the power amplifier. The first signal outputted from the first filter is supplied to the first output path. The second signal outputted from the second filter is supplied to the second output path.
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公开(公告)号:US20190123441A1
公开(公告)日:2019-04-25
申请号:US16038464
申请日:2018-07-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kaoru SUDO , Yasuhisa YAMAMOTO , Satoshi TANAKA
CPC classification number: H01Q3/2635 , H01Q1/241 , H01Q1/243 , H01Q1/521 , H01Q3/2617 , H01Q5/35 , H01Q5/42 , H01Q5/50
Abstract: A multi-antenna module includes, on or in the dielectric substrate, a first radiation element, a second radiation element that operates at a frequency band lower than that of the first radiation element, and a ground plane. A first feed line and a second feed line are provided on or in the dielectric substrate. A first switch element switches between a first state in which a signal is supplied to the second radiation element and a second state including at least one of a state in which the second radiation element is connected to the ground plane with terminal impedance interposed therebetween, a state in which the second radiation element is in a floating state with respect to the second feed line and the ground plane, and a state in which the second radiation element is short-circuited to the ground plane.
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公开(公告)号:US20170302300A1
公开(公告)日:2017-10-19
申请号:US15490021
申请日:2017-04-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi TANAKA , Kazuo WATANABE , Tetsuaki ADACHI , Masahito NUMANAMI , Yasuhisa YAMAMOTO
CPC classification number: H04B1/005 , H04L25/02 , H04W72/0453 , H04W88/06 , H04W88/08
Abstract: A communication unit includes the following elements. A first transmit circuit outputs a first signal or a second signal from a first input signal. A first amplifier amplifies the first signal and outputs a first amplified signal. A first signal generating circuit generates a third signal having a frequency higher than a frequency of the second signal, based on the second signal and a first reference signal. A first filter circuit receives the third signal and allows one of a frequency component representing a sum of the frequency of the second signal and a frequency of the first reference signal and a frequency component representing a difference therebetween to pass through the first filter circuit and attenuates the other one of the frequency components. A second amplifier amplifies the third signal output from the first filter circuit and outputs a second amplified signal.
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公开(公告)号:US20210281226A1
公开(公告)日:2021-09-09
申请号:US17193494
申请日:2021-03-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takashi YAMADA , Satoshi TANAKA , Yasuhisa YAMAMOTO
Abstract: A power amplifier module includes a substrate, an amplifier circuit including a plurality of transistors to be mounted on the substrate and a bump connected to the plurality of transistors, a harmonic termination circuit and an output matching circuit that are disposed in or on the substrate and configured to be electrically connected to the amplifier circuit, a connection pad disposed on the substrate and configured to be connected to the bump, and a plurality of connection wiring lines branching from the connection pad. The plurality of connection wiring lines include at least a first connection wiring line that connects the connection pad and the harmonic termination circuit to each other, a second connection wiring line that connects the connection pad and the output matching circuit to each other, and a third connection wiring line that connects the connection pad and an external power supply to each other.
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公开(公告)号:US20200295717A1
公开(公告)日:2020-09-17
申请号:US16351916
申请日:2019-03-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi ARAYASHIKI , Satoshi GOTO , Satoshi TANAKA , Yasuhisa YAMAMOTO
Abstract: Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.
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公开(公告)号:US20190326191A1
公开(公告)日:2019-10-24
申请号:US16374674
申请日:2019-04-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masao KONDO , Isao OBU , Yasunari UMEMOTO , Yasuhisa YAMAMOTO , Masahiro SHIBATA , Takayuki TSUTSUI
IPC: H01L23/367 , H01L23/498 , H01L23/31 , H01L23/00 , H01L23/48 , H03F1/30
Abstract: A semiconductor chip includes an active element on a first surface of a substrate. A heat-conductive film having a higher thermal conductivity than the substrate is disposed at a position different from a position of the active element. An insulating film covering the active element and heat-conductive film is disposed on the first surface. A bump electrically connected to the heat-conductive film is disposed on the insulating film. A via-hole extends from a second surface opposite to the first surface to the heat-conductive film. A heat-conductive member having a higher thermal conductivity than the substrate is continuously disposed from a region of the second surface overlapping the active element in plan view to an inner surface of the via-hole. The bump is connected to a land of a printed circuit board facing the first surface. The semiconductor chip is sealed with a resin.
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公开(公告)号:US20190190455A1
公开(公告)日:2019-06-20
申请号:US16223300
申请日:2018-12-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masao KONDO , Satoshi TANAKA , Yasuhisa YAMAMOTO , Takayuki TSUTSUI , Isao OBU
CPC classification number: H03F1/0211 , H03F3/19 , H03F3/245 , H03F2200/102 , H03F2200/222 , H03F2200/387 , H03F2200/451 , H03F2203/21103 , H03F2203/21139 , H03G3/3042 , H03G2201/106
Abstract: A transmission unit includes a first transistor that amplifies power of a first signal and outputs a second signal, a power supply circuit that supplies to the first transistor a power supply voltage that changes in accordance with an amplitude level of the first signal, and an attenuator that attenuates the first signal in such a manner that an amount of attenuation of the first signal increases with a decrease in the power supply voltage when the power supply voltage is less than a first level.
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公开(公告)号:US20220173530A1
公开(公告)日:2022-06-02
申请号:US17672696
申请日:2022-02-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki UEDA , Yasuhisa YAMAMOTO , Masashi OMURO , Kazunari KAWAHATA , Satoshi TANAKA , Ryuken MIZUNUMA
Abstract: An antenna device comprises a substrate including a planar first region and a planar second region; at least one first radiating element, arranged in the first region, that communicates a radio wave of a first frequency; and at least one second radiating element, arranged in the second region, that communicates a radio wave of a second frequency. A separation direction is a direction of a straight line connecting a first geometric center position of the at least one first radiating element and a second geometric center position of the at least one second radiating element, and in a case that the second region is viewed along a normal direction of the second region, an angle formed by the separation direction and a polarization direction of the at least one second radiating element is equal to or greater than 45° and equal to or less than 90°.
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公开(公告)号:US20210391640A1
公开(公告)日:2021-12-16
申请号:US17412621
申请日:2021-08-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Ryuken MIZUNUMA , Satoshi TANAKA , Yasuhisa YAMAMOTO , Akiko ITABASHI
IPC: H01Q1/24 , H01Q1/22 , H04B7/0413 , G06F1/16
Abstract: A communication device includes: a first body including a first display portion; a second body including a second display portion; a communication circuit that carries out millimeter-wave band communication; and one or more millimeter-wave band communication antennas provided in at least one of the first body and the second body.
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