公开(公告)号：US07603769B2

公开(公告)日：2009-10-20

申请号：US11901162

申请日：2007-09-14

Applicant: My Jang

Inventor： My Jang

IPC: H05K3/30

CPC classification number: H05K3/3442 ,  H05K3/303 ,  H05K2201/0166 ,  H05K2201/09472 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/0169 ,  H05K2203/0594 ,  H05K2203/0769 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171

Abstract: Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed there between, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

Abstract translation: 公开了将表面安装器件与印刷电路等基板连接的方法。 根据一个方面的一种方法可以包括将保持器与衬底连接，使得衬底的端子包括在保持器的开口中，将电子器件安装在端子之间，其中设置有导电接合材料，加热导电 将材料接合到其熔点，并冷却导电接合材料。

公开(公告)号：US20080005901A1

公开(公告)日：2008-01-10

申请号：US11901162

申请日：2007-09-14

Applicant: My Jang

Inventor： My Jang

IPC: H05K3/34 ,  H05K1/16 ,  H05K3/30

CPC classification number: H05K3/3442 ,  H05K3/303 ,  H05K2201/0166 ,  H05K2201/09472 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/0169 ,  H05K2203/0594 ,  H05K2203/0769 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171

Abstract: Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

Abstract translation: 公开了将诸如例如表面贴装装置的装置与衬底（例如印刷电路）耦合的方法和装置。 根据一个方面的装置可以包括衬底，与衬底耦合的多个端子，与多个端子耦合的导电接合材料，与导电接合材料耦合的电子器件，以及与 保持电子设备的基板。 根据一个方面的一种方法可以包括将保持器与衬底连接，使得衬底的端子包括在保持器的开口中，将电子器件安装在端子之间，其间设置有导电接合材料，加热导电接合 材料到其熔点，并冷却导电接合材料。