公开(公告)号：US20150218391A1

公开(公告)日：2015-08-06

申请号：US14426607

申请日：2013-09-05

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki Takahashi ,  Noriyuki Sakai ,  Akito Yoshii

IPC: C09D5/24 ,  B22F9/24 ,  C22B3/00 ,  H01B1/22 ,  C22C5/06

CPC classification number: C09D5/24 ,  B22F1/0011 ,  B22F1/0048 ,  B22F1/0059 ,  B22F9/24 ,  B22F2999/00 ,  C09D7/61 ,  C22B11/04 ,  C22C5/06 ,  H01B1/22 ,  H05K1/095 ,  C22C1/08

Abstract: A silver paste composition that includes (A) silver particles that are spherical and have continuous open pores, and a (B) resin and/or a (C) dispersant, and that preferably further comprises at least one substance selected from the group consisting of a (D) curing agent, a (E) fluxing agent, and a (F) curing accelerator. The silver paste composition serves to suppress an increase in electrical resistance and viscosity and reduces the electrical resistivity.

Abstract translation: 一种银膏组合物，其包含（A）球形并具有连续开孔的银颗粒和（B）树脂和/或（C）分散剂，并且优选还包含至少一种选自以下的物质： （D）固化剂，（E）助熔剂和（F）固化促进剂。 银糊剂组合物用于抑制电阻和粘度的增加并降低电阻率。

公开(公告)号：US10290601B2

公开(公告)日：2019-05-14

申请号：US15564674

申请日：2016-04-06

Applicant: NAMICS CORPORATION

Inventor： Raymond Dietz ,  Cathy Shaw Trumble ,  Maciej Patelka ,  Akito Yoshii ,  Noriyuki Sakai ,  Hiroshi Yamaguchi

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/40 ,  H01L21/52 ,  C03C4/14 ,  C03C8/02 ,  C03C8/08 ,  C03C8/24 ,  C03C10/00 ,  C03C3/12 ,  C03C3/14 ,  C03C3/21 ,  C03C8/18 ,  C03C27/04

Abstract: A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

公开(公告)号：US09789546B2

公开(公告)日：2017-10-17

申请号：US14644579

申请日：2015-03-11

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki Takahashi ,  Akito Yoshii

IPC: B22F9/24 ,  C22C19/03 ,  C22C5/04 ,  C22C5/02 ,  C22C1/02 ,  C22C9/00 ,  B22F9/18 ,  B22F1/00 ,  B22F3/11 ,  H01B1/22 ,  H01B1/02 ,  C22C5/06

CPC classification number: B22F9/24 ,  B22F1/0011 ,  B22F1/0014 ,  B22F3/11 ,  B22F9/18 ,  C22C1/02 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C19/03 ,  H01B1/02 ,  H01B1/22 ,  Y10T428/12

Abstract: A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles.