公开(公告)号：US20230299461A1

公开(公告)日：2023-09-21

申请号：US18010265

申请日：2021-06-17

Applicant: NAMICS CORPORATION

Inventor： Hiroshi Takasugi ,  Ryo Usami ,  Fumikazu Komatsu ,  Shin Teraki

IPC: H01Q1/22 ,  H01B3/44 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01B3/442 ,  H01L23/66 ,  H01L2223/6677

Abstract: Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10, at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.